In-Vehicle Module Heat Sink Assembly for Low-Resistance Chip Cooling
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Solution Overview
Problem
Existing in-vehicle modules face challenges in efficiently dissipating heat due to the high thermal resistance and thickness of thermal interface materials like thermal gels and thermally conductive pads, which cannot meet the increasing heat dissipation requirements as chip power consumption rises.
Innovation Solution
A heat dissipation apparatus with a heat sink housing, primary and sub printed circuit boards, and elastic support components like spring screws, which closely attach chips to a primary heat dissipation plate via sub printed circuit boards, reducing thermal resistance and allowing for easy upgrades by replacing chips and boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal gel or thermally conductive pad is used to transfer heat from the device to the housing, then heat transfer is enabled, but the large thickness and high thermal resistance prevent meeting heat dissipation requirements
Solution Approach 1:
The patent changes the physical state and properties of the thermal interface material by using phase change materials that transition from solid to liquid at operating temperatures, fundamentally altering the thermal conduction mechanism from solid-contact to liquid-filled gap conduction, thereby reducing thermal resistance
Solution Approach 2:
The patent utilizes phase transition of the thermal interface material (from solid at room temperature to liquid at operating temperature) to improve thermal contact between the device and housing, eliminating the thickness and thermal resistance issues of conventional thermal gels
2Power
If chip power consumption is increased to enhance module functions, then module capability is improved, but heat dissipation requirements become harder to meet
Solution Approach 1:
The phase change material absorbs excess heat from high-power chips by transitioning from solid to liquid, providing passive thermal management that enables higher power consumption without proportionally increasing temperature concerns
Solution Approach 2:
The patent converts the harmful heat generated by high-power chips into a useful phase transition process, where the heat itself drives the phase change that improves thermal contact and continues to dissipate heat effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal resistance and temperature, enhances heat dissipation efficiency, and supports easy upgrades while maintaining reliable electrical connections and environmental sealing.
Implementation Method 1
The elastic support component is configured to press the sub printed circuit board, to enable the chip to be closely attached to the primary heat dissipation plate
Implementation Method 2
A thermally conductive layer is filled between the chip and the primary heat dissipation plate, and the thermally conductive layer is configured to reduce contact thermal resistance between the chip and the primary heat dissipation plate
Implementation Method 3
Heat of the device with high power consumption may be transferred to the metal housing through the thermal interface material and then dissipated to the environment
Data Source
AI summary
A heat dissipation apparatus includes a heat sink housing including an upper housing and a lower housing. The upper and lowers housing are connected in a sealed manner. A primary PCB is fastened to the upper housing, and the primary PCB and the primary heat dissipation plate of the upper housing are disposed opposite to each other. A chip is fastened to a sub PCB. The sub PCB is electrically connected to the primary PCB by using a flexible conductive component. The sub PCB is connected to the primary PCB or the primary heat dissipation plate by using an elastic support component. The elastic support component is configured to press the sub PCB, to enable the chip to be closely attached to the primary heat dissipation plate of the upper housing. A thermally conductive layer is filled between the chip and the upper housing.