Circuit Board Segmentation for High Current and Signal Integrity
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Solution Overview
Problem
Increasing the packaging density and transmission speed of electronic components on a circuit board while maintaining or increasing the electric current supply is challenging due to the difficulty in forming via holes in thick wiring lines, which can cause drill breakage and resistance loss.
Innovation Solution
A circuit board design featuring a plate member with conductive terminals that connect to a printed circuit board and a heat sink, allowing for separate wiring layers for high and low currents, with large-diameter vias for high current and small-diameter vias for low current, enabling easier drilling and effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the thickness of wiring lines is increased to supply more electric current to electronic components, then the electric current supply is improved, but the difficulty of forming via holes increases and drill breakage occurs
Solution Approach 1:
The patent divides the circuit board into a first circuit board and a second circuit board, separating high-current wiring from low-current wiring. The first circuit board contains thick wiring lines for high current supply, while the second circuit board contains via holes for signal transmission. This segmentation allows each board to be optimized independently, avoiding the problem of drilling via holes through thick wiring layers.
2Productivity
If the packaging density of electronic components is increased, then the transmission speed is improved, but the difficulty of forming via holes in thick wiring lines increases
Solution Approach 1:
The patent separates the circuit board into two layers: the first circuit board for power distribution with thick wiring, and the second circuit board for signal transmission with via holes. This allows high packaging density and fast transmission speed to be achieved on the second board without the manufacturing difficulties of drilling through thick wiring on the first board.
3Power
If the thickness of wiring lines is increased to supply more electric current, then the electric current supply is improved, but resistance loss increases
Solution Approach 1:
The patent creates a dedicated first circuit board for high-current power distribution with optimized thick wiring, separating it from the second circuit board for signal transmission. This segmentation allows the power delivery path to be optimized for low resistance while keeping the signal transmission path optimized for high speed, preventing resistance loss in the signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables increased current supply, packaging density, and transmission speed on a simply processed board, avoiding drill breakage and resistance loss, while maintaining effective heat dissipation and reducing the number of components.
Implementation Method 1
a cooling member provided on the electronic component
Data Source
AI summary
A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.