Electronic device
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Solution Overview
Problem
Existing electronic devices face challenges in achieving high-density component arrangements due to limitations in substrate design and connectivity, which hinder flexibility and compatibility with diverse electronic apparatus needs.
Innovation Solution
A dual-substrate structure with passages, contacts, and conductors that allow for high-density component arrangement, utilizing conductive materials like tin, copper, and gold, and adhesion layers for precise electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional substrate design is used, then manufacturing process is simple, but component arrangement density is low
Solution Approach 1:
The patent transitions from planar component arrangement on a single substrate to three-dimensional arrangement across multiple substrates stacked vertically. Through-holes penetrate through multiple substrate layers, enabling components to be distributed in the vertical dimension, thereby increasing component arrangement density without proportionally increasing the footprint area.
Solution Approach 2:
The patent divides the conventional single substrate into multiple separate substrate layers stacked together. Each substrate can be manufactured independently and then assembled, allowing complex high-density interconnect patterns to be distributed across multiple simpler layers, connected through vertical vias and conductive structures.
2Adaptability or versatility
If high-density component arrangement is achieved, then device functionality increases, but manufacturing difficulty increases
Solution Approach 1:
By segmenting the device into multiple manufacturable substrate layers, each layer can be produced using standard manufacturing processes. The layers are then assembled through alignment and bonding, enabling high-density functionality to be achieved through modular construction rather than requiring complex single-layer manufacturing.
Solution Approach 2:
Conductive structures, including through-holes and interconnect patterns, are pre-formed in each substrate layer before final assembly. This preliminary preparation of conductive pathways in individual layers simplifies the overall manufacturing process compared to attempting to create all connections in a single complex substrate.
3Reliability
If conventional connectivity methods are used, then manufacturing is easy, but electrical connectivity efficiency is low
Solution Approach 1:
The patent introduces vertical connectivity through through-holes that penetrate multiple substrate layers, adding the vertical dimension to electrical interconnects. This three-dimensional routing provides more direct electrical pathways compared to planar routing, improving signal integrity and reducing interference while enabling efficient connectivity in high-density arrangements.
Data Source
AI summary
An electronic device includes a first substrate, a second substrate, an adhesion layer, a plurality of passages, a plurality of first contacts, a plurality of second contacts, a plurality of conductors and an electronic component. The passages are tapered from the second substrate to the first substrate. One of the first contacts conceals the first opening of the corresponding one of the passages. One of the second contacts is adjacent to the second opening of the corresponding one of the passages. The second end of the corresponding one of the conductors electrically connects the corresponding one of the second contacts and covers at least partial of the second surface of the second contact. The conductors respectively disposed in the passages. The electronic component is arranged on a first face of the first substrate and electrically connects the corresponding one of the first contacts.