Sub-module Circuit Assembly with Movable Auxiliary Carrier
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Solution Overview
Problem
Circuit arrangements with multiple sub-modules face a critical chain of tolerances when connecting auxiliary contacts to a common circuit board, leading to alignment and contact issues.
Innovation Solution
The connection device of each sub-module features a contact lug with a frame made of insulating material, including an auxiliary carrier with limited mobility and positioning elements, such as tapered pins, to precisely align and secure contacts with the printed circuit board, using fastening elements like threaded bushings for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple sub-modules are connected to a common circuit board using fixed connection devices, then the circuit arrangement can be assembled, but dimensional tolerances accumulate creating a critical tolerance chain that leads to alignment and contact issues
Solution Approach 1:
The connection device incorporates an auxiliary carrier with limited mobility that can move relative to the sub-module housing. This dynamic element absorbs dimensional tolerances by allowing the contact lug to self-adjust its position, transforming a static rigid connection into a flexible adaptive connection that maintains reliable contact despite manufacturing variations.
Solution Approach 2:
The connection device changes the physical state of the connection from rigid to flexible by introducing a movable auxiliary carrier. This parameter change allows the system to adapt to dimensional variations, converting the tolerance chain problem into a solvable configuration where the movable carrier compensates for accumulated tolerances.
2Reliability
If rigid connection devices are used to ensure stable contact, then contact pressure is maintained, but dimensional tolerances cannot be compensated leading to alignment issues
Solution Approach 1:
The auxiliary carrier is designed with limited mobility, providing a dynamic element that can adapt to dimensional variations while maintaining stable contact. This dynamic component allows the connection device to compensate for tolerances without sacrificing contact reliability, as the carrier can move within defined limits to accommodate alignment variations.
Solution Approach 2:
The auxiliary carrier acts as an intermediary element between the rigid sub-module housing and the circuit board. This mediator absorbs the dimensional tolerances through its limited mobility, protecting the overall connection stability while enabling tolerance compensation that would be impossible with direct rigid connections.
3Manufacturing precision
If precise positioning features are added to eliminate tolerance chains, then alignment precision improves, but device complexity increases
Solution Approach 1:
Instead of adding complex precise positioning features, the invention uses a simple movable auxiliary carrier that achieves alignment through its limited mobility. This dynamic approach provides tolerance compensation with minimal additional complexity, as the carrier's ability to move within defined limits naturally accommodates dimensional variations without requiring elaborate positioning mechanisms.
Solution Approach 2:
The auxiliary carrier performs self-alignment through its limited mobility, automatically compensating for dimensional tolerances without requiring external positioning features or complex adjustment mechanisms. This self-service capability achieves precise alignment while minimizing device complexity, as the carrier inherently adapts to the available space and maintains proper contact positioning.
Data Source
Figure 1
Figure 2~3
AI summary
The arrangement has contact lug (16) which is provided with a contact (18) for contacting with contact element of printed circuit board. A sub-module (10) is provided with associated substrate (12) which encloses a frame (24). The frame is attached to auxiliary carrier (28) on which contact lug is fixed. The auxiliary carrier is provided with a positioning element (36) which is provided for performing positional alignment and centering contact of corresponding contact lug with respect to contact element of sub-modules, when printed circuit board is attached to circuit arrangement structure.