Flexible Circuit Board Layout for Thin Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-layer rigid circuit boards in electronic devices become thick and heavy, hindering the development of compact and lightweight designs for devices like watches and cell phones.
Innovation Solution
The use of flexible circuit boards connected between two frame bodies with connectors, allowing for thinner and lighter electronic apparatuses by distributing hardware devices across multiple flexible boards, which are electrically connected via wires and connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multi-layer rigid circuit boards are used to increase layout area, then the total layout area is significantly increased, but the circuit board becomes very thick and heavy
Solution Approach 1:
The invention divides the circuit board into multiple flexible circuit board segments that can be bent and folded. Each segment contains a portion of the circuit layout, and they are connected through bending regions. This segmentation allows the circuit board to achieve a large total layout area when unfolded while maintaining a compact, thin form factor when folded, thereby resolving the contradiction between increasing layout area and reducing weight/thickness.
Solution Approach 2:
The invention transitions from a planar two-dimensional circuit board layout to a three-dimensional folded structure. By introducing bending regions that allow the circuit board to fold along specific axes, the layout area is expanded into the third dimension (depth/thickness direction) when folded, while maintaining a large effective area when unfolded. This dimensional transformation enables the circuit board to provide extensive layout area without proportionally increasing weight.
2Area of stationary object
If multi-layer rigid circuit boards are used to increase layout area, then the total layout area is significantly increased, but the circuit board becomes very thick
Solution Approach 1:
The circuit board is segmented into multiple flexible sections connected by bending regions. When folded, these segments stack compactly, reducing the overall thickness to a fraction of what a rigid multi-layer board would require. The segmentation enables the same layout area to be achieved with minimal thickness by utilizing the folded configuration.
Solution Approach 2:
The invention uses folding to transform the circuit board from a flat two-dimensional plane into a three-dimensional folded structure. The bending regions enable the circuit board to utilize the thickness dimension for compact storage while maintaining the full layout area functionality when deployed. This dimensional transformation allows large layout area with minimal thickness.
3Weight of stationary object
If flexible circuit boards are used to reduce thickness and weight, then the electronic apparatus becomes thinner and lighter, but the structural integrity may be compromised
Solution Approach 1:
The flexible circuit board is divided into rigid circuit segments and flexible bending regions in an alternating pattern. The rigid segments provide structural strength and support for electronic components, while the flexible bending regions provide flexibility for folding. This segmentation allows the circuit board to maintain adequate strength despite using flexible materials, resolving the contradiction between reduced weight and maintained strength.
Solution Approach 2:
Different regions of the circuit board are assigned different mechanical properties: rigid segments are designed with high strength and stiffness to support components and provide structural integrity, while bending regions are designed with high flexibility to enable folding. This local differentiation of material properties allows the overall structure to be lightweight yet sufficiently strong where needed.
4Length of stationary object
If flexible circuit boards are used to reduce thickness, then the electronic apparatus becomes thinner, but the layout area efficiency may be reduced
Solution Approach 1:
The invention uses folding to expand the two-dimensional circuit board into a three-dimensional structure. When folded, the circuit board achieves a compact thin form factor suitable for portable devices. When unfolded, the full layout area is deployed. This dimensional transformation allows the circuit board to provide extensive layout area while maintaining a thin profile during use, resolving the contradiction between reduced thickness and maintained layout area.
Data Source
AI summary
An electronic apparatus includes a frame, at least one circuit board, at least one hardware device, and at least one first connector. The frame includes a first frame body and a second frame body. The first frame body includes a first wire therein. The circuit board includes a first edge and a second, and at least a portion of the circuit board is flexible. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The circuit board is electrically connected to the first wire. The hardware device is disposed on the circuit board. The first frame body includes a first inner surface, and the first connector is disposed on the first inner surface and electrically connected to the first wire, and the first edge of the circuit board is plugged in the first connector.