SSD Circuit Board Spacer with Thermal Partition

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Solution Overview

Problem

In stacked solid-state storage drives (SSDs), the narrow space between circuit boards hinders effective heat dissipation of heat-producing components, leading to temperature increases and potential reliability issues.

Innovation Solution

The implementation of a circuit board assembly with a spacer structure that includes a partition member with a thermal transfer member to shield heat-producing components and facilitate heat dissipation through the enclosure, while maintaining mechanical and electrical connectivity between the boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If three or more circuit boards are stacked to increase storage capacity, then the storage capacity is improved, but the heat dissipation becomes insufficient and temperature rises

Engineering Contradiction:

Improvestorage capacityVSAvoidcomponent temperature

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The spacer is divided into a frame portion for structural support and a partition portion for heat management. The partition portion is further segmented into multiple heat dissipation fins that increase surface area for heat transfer, effectively segmenting the heat dissipation function across multiple surfaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The spacer acts as an intermediary component between circuit boards, serving dual functions of mechanical spacing and thermal management. The partition portion with heat dissipation fins serves as a thermal mediator, transferring heat from components on one circuit board to the spacer structure and ultimately to the enclosure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If circuit boards are stacked closely to reduce device size, then the device compactness is improved, but the heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of moving objectVSLoss of energy

Solution Approach 1:

The partition portion extends in the vertical dimension between circuit boards, creating heat dissipation surfaces that utilize the z-axis space. The heat dissipation fins add another dimension of surface area without increasing the horizontal footprint, allowing effective heat dissipation within a compact volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The partition portion with heat dissipation fins creates a porous-like structure with multiple surfaces and channels for heat transfer. This increased surface area-to-volume ratio enables efficient heat dissipation while maintaining compact dimensions, similar to how porous materials provide large internal surfaces within small external volumes.

Inventive Principle:

Principle #31Porous materials

3Loss of energy

If a thermal transfer member is added to the partition member to improve heat dissipation, then the heat dissipation capability is improved, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The thermal transfer member is merged with the partition member to form an integrated spacer component. The frame portion, partition portion, and thermal transfer member are combined into a single structural element that performs both mechanical spacing and thermal management functions simultaneously, reducing the number of separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The spacer is designed as a multi-functional component that simultaneously provides mechanical support (frame portion), structural spacing (partition portion), and thermal management (thermal transfer member). This universal design allows a single component to fulfill multiple functions that would traditionally require separate parts, thereby reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prevents temperature increases in SSD components, enhances reliability, and supports strong connector engagement and shock resistance at a low cost by integrating thermal management with the spacer design.

Implementation Method 1

a thermal transfer member attached to the partition member and in contact with the first circuit board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9807899B2Storage device

Publication Date: 2017.10.31 KIOXIA CORP

AI summary

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.