Two-Level PCB Layout for PCIe Card Cooling Airflow
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Solution Overview
Problem
Conventional card-based processing subsystems face challenges in efficiently removing heat due to the large size of the PCB, which obstructs airflow and leads to thermal damage and performance constraints, as most components are mounted on one side of the PCB to comply with PCIe specifications.
Innovation Solution
A two-level PCB design is implemented, with components distributed evenly across the topside and backside of the main PCB, allowing taller components to be mounted on the backside while adhering to PCIe height limits, thereby reducing the PCB's surface area and enhancing airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If most electronic components are mounted on the topside of the PCB to satisfy PCIe specifications, then the PCIe compliance is maintained, but the PCB surface area cannot be reduced and airflow is obstructed
Solution Approach 1:
The patent transitions from a single-sided component mounting approach to a dual-sided mounting approach by utilizing the third dimension (vertical height). By mounting taller components on the backside of the PCB and shorter components on the front side, the design complies with PCIe height specifications while effectively utilizing both surfaces of the PCB, thereby reducing the required PCB surface area and improving airflow characteristics.
2Temperature
If the PCB size is reduced to enhance airflow, then heat removal is improved, but the space for mounting electronic components is reduced
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension to mount components on both sides of the PCB. This allows the PCB surface area to be reduced for improved airflow and heat removal, while still providing sufficient mounting space for all required electronic components by distributing them across the front and back surfaces.
Solution Approach 2:
The patent applies different mounting strategies to different regions of the PCB based on component height requirements. Taller components are positioned on the backside where they can be accommodated, while shorter components are placed on the front side, creating an optimized local distribution that maximizes airflow paths and heat dissipation surfaces.
3Device complexity
If taller components are mounted on the backside of the PCB, then component distribution is improved and PCB area is reduced, but PCIe height limit specifications must be satisfied
Solution Approach 1:
The patent utilizes the vertical dimension to accommodate taller components on the backside of the PCB while maintaining compliance with PCIe height specifications. By measuring height from the PCB surface rather than from a fixed reference plane, the design achieves better component distribution and reduced PCB area while still satisfying the specification requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat removal and computing performance by increasing airflow and reducing temperature, as well as allowing for additional heat sinks to be added, thus overcoming the limitations of conventional designs.
Implementation Method 1
greater overall airflow can be achieved throughout a processing subsystem that incorporates the two-level PCB design by enhancing airflow through a heatsink/exchanger due to the reduced blockage by the PCB
Implementation Method 2
overall heat removal from the processing subsystem during operation can be improved, which can reduce the temperature of the processor and other mounted electronic components
Data Source
AI summary
According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.