Folded Circuit Board Interposer With EMI Shielding
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Solution Overview
Problem
Existing interposers for connecting circuit boards are challenging to produce and provide inadequate mechanical and electrical performance, especially when stacking boards to reduce footprint area, due to misalignment issues and high costs associated with labor-intensive construction processes.
Innovation Solution
The development of an interposer with a conductive layer and insulating substrate, featuring discrete pins that span between mounting surfaces, allowing for improved signal transmission and electromagnetic shielding, while being flexible and easier to manufacture through a process involving cutout regions and folding of conductive sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional interposer is used to mechanically and electrically connect stacked circuit boards, then electrical connection is achieved, but manufacturing complexity and cost increase due to labor-intensive construction processes
Solution Approach 1:
The interposer is segmented into distinct functional components: an insulating substrate providing mechanical support, discrete pins providing electrical connections, and a conductive layer providing electromagnetic shielding. This segmentation allows each component to be optimized independently and assembled through simpler processes compared to conventional monolithic interposers.
Solution Approach 2:
The interposer employs composite construction combining an insulating substrate material with discrete conductive pins and a conductive shielding layer. This composite approach integrates materials with complementary properties (electrical insulation, electrical conduction, and electromagnetic shielding) into a single structure that achieves multiple functions simultaneously while simplifying manufacturing.
2Area of stationary object
If circuit boards are stacked to reduce footprint area, then area utilization improves, but misalignment issues arise between stacked boards
Solution Approach 1:
The interposer acts as an intermediary component between stacked circuit boards, providing a standardized interface with mounting surfaces and discrete pins that facilitate precise alignment. The insulating substrate with defined mounting surfaces serves as a mediator that ensures accurate positioning of upper and lower circuit boards, eliminating direct alignment requirements between the boards themselves.
3Reliability
If discrete pins are used for electrical connection instead of continuous conductive paths, then signal transmission quality improves, but manufacturing complexity increases
Solution Approach 1:
The interposer applies local quality by using discrete pins at specific locations where electrical connections are needed, rather than continuous conductive paths throughout the entire structure. Each pin provides localized electrical connection where required, while the insulating substrate maintains electrical isolation in other areas. This approach optimizes signal transmission at connection points while simplifying overall manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides superior electrical and mechanical performance, enabling high-speed signal transmission and reduced electromagnetic interference, while simplifying the manufacturing process and reducing costs compared to conventional interposers.
Implementation Method 1
The first layer can be an electrical conductor that can provide electromagnetic shielding to the area
Implementation Method 2
The discrete pins can be carried by the substrate and be positioned from the first mounting surface to the second mounting surface such that the discrete pins can transmit signals between the first and second circuit boards
Data Source
AI summary
An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.