Stacked Wiring Board Module for IC Noise Reduction
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Solution Overview
Problem
Existing modules with integrated circuit components and wiring boards face challenges in achieving higher-density packaging while reducing noise, particularly due to heat effects that lead to noise generation in integrated circuit components.
Innovation Solution
A module configuration that includes a first wiring board with an integrated circuit component, a second overlapping wiring board with another integrated circuit component, and a connection member to electrically connect them, where the second component supplies power to the first component, reducing heat effects and noise by creating a gap between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuit components are mounted on the same wiring board to achieve higher-density packaging, then packaging density is improved, but heat effects increase causing noise generation
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of components on a single wiring board to a three-dimensional stacked configuration with multiple wiring boards arranged in layers. The first and second wiring boards are positioned at different heights (Z-direction) and connected vertically, enabling higher packaging density while spatially separating heat-generating components to reduce thermal interference.
Solution Approach 2:
The patent divides the integrated circuit system into separate functional modules mounted on different wiring boards. The signal processing circuit and power supply circuit are segmented onto distinct boards (first and second wiring boards), allowing independent thermal management and reducing heat accumulation effects that would occur if all components were concentrated on a single board.
2Quantity of substance
If integrated circuit components are mounted on the same wiring board, then packaging density is improved, but noise generation increases
Solution Approach 1:
The patent segments noisy power supply circuits from sensitive signal processing circuits by mounting them on separate wiring boards. This spatial separation prevents electromagnetic interference and noise coupling that would occur in a densely packed single-board configuration, while still achieving high integration through the multi-board stacked architecture.
Solution Approach 2:
The connection member serving as an inter-board connector acts as an intermediary that provides both electrical connectivity and electrical isolation between the first and second wiring boards. This mediator enables signal transmission while blocking noise propagation, resolving the contradiction between dense integration and noise reduction.
3Object-generated harmful factors
If multiple wiring boards are stacked to reduce heat effects, then noise reduction is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functional circuits (signal processing, power supply, control) across multiple wiring boards into a unified stacked module. The connection member integrates the electrical interconnections between boards, creating a consolidated assembly that achieves noise reduction through spatial separation while maintaining a compact, manageable module structure.
Data Source
AI summary
A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.