Multi-layer Circuit Board Segmented Testing via Conducting Blocks
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Solution Overview
Problem
Conventional multi-layer circuit boards are completed before testing, making it difficult to identify and diagnose defective conductor layers, leading to material waste, increased costs, and reduced yield due to the inability to test individual boards during fabrication.
Innovation Solution
A multi-layer circuit board design featuring conducting blocks and recesses with an insulating layer, allowing for individual testing and fault diagnosis of each circuit board before completion, with conducting blocks and recesses enabling electrical connection between layers and preventing short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional multi-layer circuit boards are completed before testing, then the fabrication process is simplified and continuous stacking is enabled, but individual board testing becomes impossible and defect identification is delayed
Solution Approach 1:
The patent divides the multi-layer circuit board into separable individual boards, each with its own conductor layers and insulating layers. This segmentation allows each board to be tested independently during fabrication while maintaining the ability to stack them continuously into a multi-layer structure. The conducting blocks serve as separable connection points that enable both individual testing and final assembly.
2Productivity
If individual boards are made separable for testing, then defect identification improves and yield increases, but the fabrication process complexity increases
Solution Approach 1:
The patent incorporates testing capabilities into each individual board during the fabrication process itself, before the boards are stacked into the final multi-layer structure. This preliminary testing action allows defects to be identified and addressed early, preventing wasted material and reducing rework later. The conducting blocks are prepared in advance with test access points that enable this preliminary verification.
3Reliability
If conductor layers are connected through filled vias, then electrical connection between layers is achieved, but defect diagnosis becomes difficult once stacked
Solution Approach 1:
The patent introduces conducting blocks as intermediary elements between conductor layers, which serve dual purposes: they provide reliable electrical connection through electroplating (similar to filled vias) while also serving as accessible test points for fault diagnosis. These conducting blocks are positioned to allow testing equipment to access and verify electrical continuity without requiring disassembly of the stacked structure, thus maintaining both reliability and diagnostic ease.
Data Source
AI summary
A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.