Board-Level Structure With Recessed Mounting for Tall Components
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Solution Overview
Problem
Existing electronic components with large heights occupy excessive Z-direction space on circuit boards, complicating the soldering process and limiting the integration of other components due to the need for separate soldering and complex manufacturing processes.
Innovation Solution
A board-level structure with a second substrate featuring an accommodation portion, such as a through or blind slot, allows the first substrate and its components to be bridged over the slot, simplifying the soldering process by forming joints on the substrate surface in a single step and reducing the need for additional pads, while offsetting the component's height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a component with large height is directly soldered to the bottom surface of a slot in the circuit board, then the Z-direction height occupation is reduced, but the soldering process becomes complex and separate from other components
Solution Approach 1:
The circuit board is segmented into two functional layers: a first substrate for standard surface mounting and a second substrate with an accommodation portion for the tall component. This segmentation allows each substrate to be optimized for its specific function, enabling simultaneous soldering while maintaining space efficiency.
Solution Approach 2:
The accommodation portion creates a vertical dimension solution by recessing into the circuit board structure. This allows the tall component to be mounted on the first substrate while its height is offset by the depth of the accommodation portion in the second substrate, achieving Z-direction space reduction without complicating the soldering process.
2Ease of operation
If a component with large height is mounted on the circuit board, then the component can be installed, but it occupies excessive external space and limits thin design
Solution Approach 1:
The accommodation portion in the second substrate creates a nested structure where the tall component's lower portion is accommodated within the recessed space. This nesting approach allows the component to be installed easily on the first substrate while the accommodation portion absorbs the excess height, effectively reducing external space occupation.
3Reliability
If a pad is disposed in the accommodation portion to solder the component, then the component can be soldered, but additional pads and complex processes are required
Solution Approach 1:
The soldering function is extracted from the accommodation portion and relocated to the first substrate. The component is soldered to the first substrate using standard surface mounting techniques, while the accommodation portion serves purely as a spatial offset structure. This extraction eliminates the need for additional pads in the accommodation portion and simplifies the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces Z-direction space occupation, simplifies assembly, enhances mounting tolerance, and minimizes the impact of vibration and heat on sensitive components, facilitating a thin design and improved integration of electronic devices.
Implementation Method 1
The first substrate is soldered to the second substrate through the second solder joint and the third solder joint
Data Source
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AI summary
This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion. In this application, the accommodation portion can offset a part of a Z-direction height of the first body, to reduce space occupation. The first substrate may be directly soldered to the second substrate through the second solder joint and the third solder joint. Therefore, a pad needs to be formed on a surface of the second substrate in only one process flow to connect to the first substrate, thereby simplifying an assembly process and ensuring assembly quality.