Stacked Circuit Board Module With Segmented Pin Interconnects
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Solution Overview
Problem
Existing circuit modules face challenges in mounting more components between substrates due to increased spacing and the risk of conductive structures falling, as seen in semiconductor device packages like U.S. Pat. No. 11,133,244.
Innovation Solution
The circuit module design includes an upper and lower circuit board connected by first and second conductor members, where the second conductor members are longer and thicker than the first, allowing for more components to be mounted while reducing the risk of conductor failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the interval between the first substrate and the second substrate is increased to mount more components, then the component mounting capacity is improved, but the conductive structure becomes longer and more prone to falling
Solution Approach 1:
The conductive structure is divided into multiple segments: a first conductive structure on the first substrate, a second conductive structure on the second substrate, and a third conductive structure connecting them. This segmentation allows each conductive segment to be shorter and more stable while maintaining electrical connectivity across the increased substrate interval, enabling more components to be mounted between substrates.
2Quantity of substance
If a single long conductive structure is used to connect substrates with increased interval, then the component mounting capacity is improved, but the manufacturing precision requirement increases due to the risk of conductor falling
Solution Approach 1:
The conductive path is segmented into multiple shorter structures that can be manufactured and positioned independently with standard precision requirements. The first conductive structure is mounted on the first substrate, the second on the second substrate, and the third connects them, allowing each to be fabricated and aligned separately without requiring ultra-precise single-step alignment.
Solution Approach 2:
The third conductive structure acts as an intermediary element that bridges the gap between the first and second conductive structures. This intermediary approach allows for standardized manufacturing processes on each substrate while maintaining reliable electrical connection, reducing the overall manufacturing precision burden compared to a single long conductive structure.
Data Source
AI summary
A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.