Thermal Frame for Circuit Board Heat Dissipation
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Solution Overview
Problem
The longevity and reliability of electronic assemblies are compromised due to inadequate heat dissipation from operating components, necessitating an enhancement in thermal management.
Innovation Solution
An electronic assembly design featuring a frame or heat-sinking spacer that separates and mechanically couples two circuit boards, utilizing thermal paths and dielectric members for efficient heat dissipation, with the frame providing material mass and air gaps to facilitate heat transfer from components to ambient air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If circuit boards are mounted in close proximity to maximize space utilization, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
A thermally conductive spacer is introduced as an intermediary component between the first and second circuit boards. This spacer provides a controlled thermal pathway that enables heat transfer from components on one circuit board to the other circuit board or to a heat sink, thus improving heat dissipation while maintaining compact device volume.
Solution Approach 2:
The patent utilizes the vertical dimension (z-axis) by stacking circuit boards with spacers between them, rather than placing components only in the horizontal plane. This three-dimensional arrangement allows heat to dissipate vertically through the spacer to the housing or ambient air, improving thermal management without increasing the device's footprint.
2Temperature
If circuit boards are separated to improve heat dissipation, then temperature control is improved, but device compactness deteriorates
Solution Approach 1:
The spacer thickness is optimized to provide adequate thermal resistance for heat dissipation while minimizing the vertical distance between circuit boards. By carefully selecting the spacer dimension parameter, the design achieves a balance between thermal management requirements and compactness goals.
3Temperature
If thermal pathways are extended to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The spacer serves multiple functions simultaneously: it provides mechanical support and spacing between circuit boards, acts as a thermal management component by conducting heat, and serves as a structural element that maintains device integrity. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively enhances heat dissipation by conducting heat away from components through the frame and housing sections, improving the reliability and longevity of electronic assemblies.
Implementation Method 1
A frame (e.g., or heat-sinking spacer) is secured to the first circuit board... conducting heat away from components through the frame and housing sections
Implementation Method 2
The frame providing material mass and air gaps to facilitate heat transfer from components to ambient air
Data Source
AI summary
An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board.