Stacked Board Heat Dissipation via Segmented Thermal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation techniques for electronic components on circuit boards restrict land design due to the need for comprehensive heat dissipation coverage, which can impede insulation and increase complexity.
Innovation Solution
A board unit design featuring a first and second circuit board stack with an electronic component positioned between them, utilizing a first and second heat dissipation member and heat transfer portions to enhance heat dissipation while minimizing land design restrictions, including a metal member with protruding portions and flexible heat transfer members to optimize thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation sheets and heat diffusion panels are provided to cover the entire soldered surface of the circuit board, then heat dissipation is enhanced, but the land design of the board is significantly restricted
Solution Approach 1:
The heat dissipation function is segmented into multiple components: heat dissipation sheets placed at specific locations rather than covering the entire surface, heat diffusion panels positioned selectively, and heat dissipation spacers providing localized thermal management. This segmentation allows heat dissipation while preserving land design flexibility for electrical connections.
Solution Approach 2:
Heat dissipation components are strategically positioned at locations where heat generation is most intense or where thermal management is most critical, rather than uniformly distributing heat dissipation coverage across the entire board surface. This localized approach optimizes thermal performance while minimizing impact on land design.
2Temperature
If heat dissipation components are added to enhance thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Multiple heat dissipation functions are merged into integrated structures: the heat diffusion panel combines thermal conduction and structural support functions, while heat dissipation spacers simultaneously provide thermal management and mechanical spacing between stacked boards. This merging reduces the number of separate components needed.
Solution Approach 2:
Heat dissipation components are designed to perform multiple functions: structural support, electrical insulation, mechanical spacing, and thermal management. This multi-functionality reduces overall device complexity by eliminating the need for separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat dissipation of electronic components without restricting the land design of the circuit boards, allowing for improved thermal conductivity and reflow processing capabilities.
Implementation Method 1
a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion
Implementation Method 2
a second heat transfer portion that thermally connects the electronic component and the second circuit board
Data Source
AI summary
A board unit includes: a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other; an electronic component mounted on the first circuit board; a first heat dissipation member that covers the board stack from outside of the first circuit board; a second heat dissipation member that covers the board stack from outside of the second circuit board; a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion; and a second heat transfer portion that thermally connects the electronic component and the second circuit board. The electronic component has a body located between the first circuit board and the second circuit board, and the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component.