Optical Transceiver Thermal Gel and Heat Dissipation Sheet Design
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Solution Overview
Problem
Optical transceivers face challenges in effectively dissipating heat generated by high-speed electrical signals, which can lead to overheating and component failure, particularly in compact designs like the SFP standard where space for heat dissipation is limited.
Innovation Solution
The optical transceiver employs a thermal conductive gel sandwiched between printed circuit boards and a protection member with openings, along with heat dissipation sheets, to create efficient heat dissipation paths and maintain component alignment, ensuring reliable heat transfer to the housing for dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the optical transceiver uses a compact design (SFP standard), then the device size is reduced, but the space for heat dissipation is limited
Solution Approach 1:
The patent utilizes the thickness dimension (z-direction) between the first and second printed circuit boards to accommodate the thermal conductive gel and heat dissipation structure. By arranging the thermal conductive gel in the space between PCBs rather than only in-plane, the design effectively uses the third dimension to provide heat dissipation path without increasing the footprint area, thus resolving the contradiction between compact device size and heat dissipation space.
2Temperature
If thermal conductive gel is used for heat dissipation, then heat transfer efficiency is improved, but the gel may overflow and misalign components
Solution Approach 1:
The protection member acts as a flexible containment structure that surrounds the thermal conductive gel. This protective shell prevents the gel from overflowing while allowing it to maintain good thermal contact with the heat generating component. The protection member thus resolves the contradiction by containing the gel within defined boundaries, preventing misalignment issues while preserving heat transfer efficiency.
Solution Approach 2:
The thermal conductive gel is selectively applied only in specific locations where heat dissipation is needed, rather than uniformly across the entire PCB surface. The gel is positioned precisely between the heat generating component and the second printed circuit board, creating a localized thermal management solution that avoids unnecessary material presence and potential overflow issues in other areas.
3Speed
If high-speed electrical signals are used, then data transmission speed is improved, but Joule heat generation increases
Solution Approach 1:
The thermal conductive gel serves as an intermediary substance that facilitates heat transfer from the heat generating component to the second printed circuit board. This mediator enables efficient thermal management of the Joule heat produced by high-speed electrical signals, allowing the system to operate at high speeds while maintaining thermal balance through the gel's heat conduction properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates Joule heat from heat-generating components, preventing overheating and ensuring stable operation while maintaining component alignment and preventing thermal gel overflow.
Implementation Method 1
a thermal conductive gel arranged between the first printed circuit board and the second printed circuit board to be contact with each of at least the heat generating component, the protection member and the second printed circuit board
Implementation Method 2
a first heat dissipation sheet arranged between the second printed circuit board and the first surface in the internal space; and a second heat dissipation sheet arranged between the first printed circuit board and the second surface in the internal space
Data Source
AI summary
An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.