Stacked Semiconductor Module Using Flexible PCB and Conductive Adhesive
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for increasing memory capacity in electronic systems, such as computers, face challenges in efficiently connecting multiple memory modules due to the need for high-reliability connection devices and limited stacking capacity, which hinders mass production and increases fabrication costs.
Innovation Solution
A stacked semiconductor module is developed, comprising a rigid PCB with mounted semiconductor devices and a flexible PCB that can bend to connect to the rigid PCB, using conductive adhesive and via plugs to establish electrical connections, allowing for a high-capacity memory module with improved connection reliability and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional connection devices are used to connect multiple memory modules, then connection reliability is improved, but device complexity and production cost increase
Solution Approach 1:
The patent combines the connection device functions into the PCB structures themselves. The rigid PCB and flexible PCB are directly connected through tab contacts without requiring separate connection components. This merging of connection functions into the structural elements resolves the contradiction by eliminating additional devices while maintaining connection reliability through the direct tab-to-tab contact mechanism.
Solution Approach 2:
The PCB tabs serve dual purposes: they provide both structural support and electrical connection functions. The flexible PCB's tabs automatically align and contact the rigid PCB's tabs through the bending action, creating a self-connecting mechanism that eliminates the need for separate connection devices and reduces production complexity.
2Quantity of substance
If more memory modules are connected to increase capacity, then memory capacity is improved, but the thickness limitation reduces productivity
Solution Approach 1:
The patent transitions from horizontal expansion (adding modules side-by-side) to vertical stacking (connecting modules through thickness). The flexible PCB enables this dimensional change by bending to connect the second memory module to the first, allowing capacity expansion in the vertical dimension without increasing footprint, thereby improving production efficiency and space utilization.
3Ease of manufacture
If conventional connection methods are used, then manufacturing process is simple, but signal transmission path length increases reducing speed
Solution Approach 1:
The flexible PCB is designed to bend into a curved configuration, creating a compact three-dimensional structure. This curvature brings the signal transmission path from the second memory module directly to the connector in a shortened route, reducing path length and increasing signal speed while maintaining manufacturing simplicity through standard flexible PCB fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of high-capacity stacked memory modules with enhanced reliability and reduced production costs, facilitating mass production by shortening signal transmission paths and improving connection efficiency between rigid and flexible PCBs.
Implementation Method 1
a first conductive adhesive between the second tabs and the third tabs
Data Source
AI summary
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.