Low-Profile Circuit Module Using Ellipsoidal Solder Balls
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Solution Overview
Problem
Conventional circuit modules with columnar pins face challenges in reducing height due to manufacturing errors that can result in pins being longer than the distance between mounting boards, preventing contact between electronic components and increasing module height.
Innovation Solution
The use of ellipsoidal-shaped solder balls to electrically connect circuit boards, ensuring contact between components and allowing for a reduction in module height by adjusting the length of the solder balls during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If columnar pins are used to connect mounting boards, then electrical connection between boards is achieved, but manufacturing errors cause pins to be longer than the distance between boards, preventing contact between electronic components and increasing module height
Solution Approach 1:
The patent changes the connection structure from rigid columnar pins to ellipsoidal solder balls with adjustable parameters. The solder balls can be deformed during mounting to adapt to varying distances between circuit boards, allowing the system to accommodate manufacturing tolerances while maintaining contact between electronic components and reducing overall module height.
2Length of moving object
If the distance between mounting boards is reduced to lower module height, then height is reduced, but manufacturing errors cause pin length to exceed the reduced distance, preventing component contact
Solution Approach 1:
The patent introduces dynamic adaptability by using ellipsoidal solder balls that can deform under compression during the mounting process. This dynamic characteristic allows the connection structure to adjust to variations in board distance caused by manufacturing tolerances, ensuring reliable contact between electronic components without requiring precise distance control.
3Stability of the object's composition
If columnar pins are used for connection, then structural stability is provided, but the fixed length cannot accommodate manufacturing variations, leading to height increase
Solution Approach 1:
The patent segments the connection function into two parts: the ellipsoidal solder ball provides adaptive length adjustment while the solder material maintains stable electrical and mechanical connection. This segmentation allows the system to achieve both height reduction and connection stability by separating the length adaptation function from the connection stability function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the height of the circuit module by ensuring the solder balls match the distance between the boards, facilitating contact and minimizing space between components.
Implementation Method 1
one or more first solder balls having an ellipsoidal shape, the one or more first solder balls being located in an inter-board region between the first circuit board and the second circuit board and electrically connecting the first circuit board and the second circuit board
Data Source
AI summary
A circuit module of the present disclosure includes a first circuit board, a second circuit board, a first electronic component, and one or more first solder balls. The first circuit board includes a first positive main surface and a first negative main surface. The first electronic component includes a third positive main surface and a third negative main surface. The one or more first solder balls have an ellipsoidal shape. The one or more first solder balls are located in an inter-board region between the first circuit board and the second circuit board. The first solder ball electrically connects the first circuit board and the second circuit board. The third positive main surface of the first electronic component is in contact with the first negative main surface of the first circuit board.