3D Loop Heat Exchanger Cover-Plate Layout for Vapor Return

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Solution Overview

Problem

Existing three-dimensional heat sinks or heat exchangers face challenges in maintaining efficient circulation of vaporized steam or working fluid between the heat pipes and the vapor chamber due to difficulties in rejoining ends, hindering the loop-type heat exchanging device's efficiency.

Innovation Solution

A three-dimensional loop-type heat exchanging device integrates heat pipes with a cover plate of a vapor chamber, featuring larger through-holes and supporting structures to facilitate the entry of vaporized steam or working fluid, while ensuring secure mounting and directing the flow within the loop-type mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If heat pipes are integrated within the bottom plate of the vapor chamber, then structural stability at junctions is enhanced and junction area is increased, but vaporized steam or working fluid circulation back into the heat pipes is hindered

Engineering Contradiction:
Improvestructural stability at junctionsVSAvoidvaporized steam or working fluid circulation efficiency
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

Instead of integrating heat pipes into the bottom plate as in conventional designs, this patent inverts the integration location to the cover plate. The heat pipes are welded to the cover plate with their ends extending into the vapor chamber, allowing vaporized steam to freely circulate back into the heat pipes while maintaining structural stability at the junctions.

Inventive Principle:
Principle #13The other way round (Inversion)

2Area of stationary object

If heat pipes are integrated within the bottom plate of the vapor chamber, then junction area is increased, but it becomes difficult for vaporized steam or working fluid to circulate back into the heat pipes

Engineering Contradiction:
Improvejunction areaVSAvoidloop-type heat exchanging efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The patent reverses the conventional integration approach by mounting heat pipes on the cover plate instead of the bottom plate. This inversion maintains adequate junction area for structural stability while creating open pathways for vaporized steam to circulate freely back into the heat pipes, thereby improving loop-type heat exchanging efficiency.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If ends of heat pipes are perforated and welded inside the bottom plate, then vacuum chamber is maintained and heat transfer is facilitated, but circulation of working fluid back into heat pipes is restricted

Engineering Contradiction:
Improvevacuum chamber maintenanceVSAvoidworking fluid circulation
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

Instead of welding perforated heat pipe ends inside the bottom plate, the patent welds heat pipes to the cover plate with their ends extending into the vapor chamber. This inversion maintains the vacuum chamber integrity through proper welding while allowing vaporized steam and working fluid to circulate freely back into the heat pipes without restriction.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient circulation and secure mounting of heat pipes, enhancing the functionality of the loop-type heat exchanging device by allowing vaporized steam or working fluid to flow in a specified direction, thus improving heat transfer efficiency.

Implementation Method 1

the second supporting structure is made of capillary material

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

facilitating efficient heat transfer through phase changes between vapor and liquid

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

facilitating efficient heat transfer through phase changes between vapor and liquid

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20260071826A1Three-dimensional loop-type heat exchanging device
Publication Date: 2026.03.12 NIDEC CHAUN-CHOUNG TECH CORP
  • US20260071826A1 patent drawing
  • US20260071826A1 patent drawing
  • US20260071826A1 patent drawing

AI summary

A three-dimensional loop-type heat exchanging device includes a vapor chamber and at least one loop heat pipe. The vapor chamber has a bottom plate and a cover plate that together enclose an accommodating space. The cover plate has at least one first through-hole and a second through-hole. The loop heat pipe is disposed on the cover plate and has a curved section, a first end, and a second end. The first end is inserted in the first through-hole and has a first joint edge stacked on an inner surface of the cover plate. The second end is inserted in the second through-hole and has a second joint edge stacked on the inner surface of the cover plate. The vapor chamber has at least one first supporting structure and at least one second supporting structure, which is made of capillary material.