3D Memory Fishbone Dielectric Support Structure
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Solution Overview
Problem
Existing 3D memory devices face challenges in achieving higher storage capacity within a smaller form factor without compromising operation performance, as critical dimensions shrink and storage density requirements increase.
Innovation Solution
A three-dimensional memory device is fabricated with a multi-layer stacked structure featuring conductive and insulating layers, including a stair region with dielectric posts or fishbone dielectric structures that serve as support to prevent insulating layer collapse and avoid bridging between metal posts, using materials like tungsten and silicon oxide, and incorporating gate-all-around transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If critical dimensions are shrunk to increase storage capacity, then storage density is improved, but structural stability deteriorates causing insulating layer collapse
Solution Approach 1:
The patent divides the continuous insulating layer into multiple discrete insulating layers separated by dielectric posts. This segmentation prevents the collapse of the entire insulating structure by isolating individual layers, allowing critical dimensions to be shrunk while maintaining structural stability through distributed support points.
Solution Approach 2:
Dielectric posts are introduced as intermediary support structures between the insulating layers and the substrate. These posts act as mediators that provide mechanical support to the insulating layers, preventing their collapse under the stress of reduced critical dimensions while maintaining electrical isolation.
2Quantity of substance
If multi-layer stacked structure is implemented to increase storage density, then storage capacity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into the dielectric posts: they provide mechanical support for insulating layers, serve as electrical isolation barriers, and act as spacers for metal posts. This merging of functions reduces the number of separate components needed, simplifying the overall manufacturing process while achieving high storage density through the multi-layer stacked structure.
Solution Approach 2:
The dielectric posts are designed as universal elements that simultaneously perform multiple functions: structural support, electrical isolation, and spacing. This multi-functionality reduces manufacturing complexity by eliminating the need for separate components for each function, while still enabling the complex multi-layer stacked structure required for high storage density.
3Quantity of substance
If metal posts are placed closer together to increase storage capacity, then storage density is improved, but bridging between metal posts occurs
Solution Approach 1:
Dielectric posts are positioned between adjacent metal posts to serve as intermediary electrical isolation barriers. This prevents direct electrical contact (bridging) between metal posts that are placed closer together to increase storage capacity, maintaining electrical isolation reliability while enabling higher storage density through reduced spacing.
Solution Approach 2:
The patent applies dielectric material specifically at critical locations where metal posts are positioned close together. This localized application of electrical isolation provides targeted protection against bridging where it is most needed, while allowing metal posts to be placed closer in other areas to maximize storage capacity.
Data Source
AI summary
A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure. The multi-layer stacked structure includes a stair region and an non-stair region, the stair region includes a plurality of steps, each step includes an immediately-adjacent pair of the conductive layers and insulating layers. A plurality of memory structures are located in the non-stair region, and each memory structure passes through the conductive layers and the insulating layers. A fishbone dielectric structure includes a main bone and a plurality of side bones extending from the main bone in the stair region, wherein the main bone crosses the memory structures in the non-stair region.