3D Memory Structure Recess Isolation for Peripheral Circuit Protection
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Solution Overview
Problem
Conventional 3D memory structures face challenges in maintaining the electrical characteristics of peripheral circuits due to high-temperature processes used in forming memory components, leading to decreased product yield and increased costs.
Innovation Solution
A method where a recess is formed on a substrate, and the 3D memory component is fabricated within this recess before forming the peripheral circuit on the substrate outside the recess, thereby isolating the memory component's high-temperature processes from affecting the peripheral circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the peripheral circuit is formed on the substrate prior to the formation of the memory component, then the memory component can be formed with high-temperature processes, but the electrical characteristic of the devices in the peripheral circuit is adversely affected
Solution Approach 1:
The substrate is divided into two distinct regions: a first region for forming the memory component and a second region for forming the peripheral circuit. This spatial segmentation allows different process conditions (high-temperature for memory, low-temperature for peripheral circuit) to be applied independently to each region, resolving the contradiction between manufacturing precision requirements and electrical characteristic preservation.
2Productivity
If the peripheral circuit is formed on the substrate prior to the formation of the memory component, then the memory component can be formed, but the product yield decreases
Solution Approach 1:
By segmenting the substrate into separate regions for memory component and peripheral circuit formation, the patent enables independent process optimization. The peripheral circuit region can be processed at lower temperatures that preserve device characteristics, while the memory region undergoes necessary high-temperature processes, thereby maintaining both manufacturing efficiency and product yield.
3Ease of manufacture
If the peripheral circuit is formed on the substrate prior to the formation of the memory component, then the manufacturing process can proceed, but the production costs increase
Solution Approach 1:
The patent applies spatial segmentation of the substrate into distinct processing regions, which allows each region to undergo appropriately optimized processes. This reduces rework and defect rates, thereby lowering production costs despite the added complexity of region-specific process control.
Data Source
AI summary
A method for manufacturing a three-dimensional (3D) memory structure and a 3D memory structure are disclosed. A recess is formed on a substrate, a 3D memory component is formed with a bottom in the recess, and then, a peripheral circuit is formed on the substrate outside the recess.