3D Memory Shielding Layer for Signal Integrity
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Solution Overview
Problem
The stacked architecture of 3D memory devices leads to increased noise and signal distortion due to extra capacitance and resistance from additional metal routing, causing coupling effects between periphery circuits and memory arrays, which exacerbates signal integrity issues during operation.
Innovation Solution
Incorporating a shielding layer with a conduction region between the peripheral device and memory strings or between the memory strings and peripheral device, which receives a grounding voltage to reduce or eliminate the coupling effect by shielding electrical energy transfer between metal interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a stacked 3D memory architecture is used to increase memory density, then memory capacity is improved, but signal distortion and noise increase due to additional metal routing and capacitance
Solution Approach 1:
A shielding layer is introduced as an intermediary component between the memory array and peripheral circuits. This shielding layer includes a conduction region configured to receive a grounding voltage, which mediates the electromagnetic coupling between adjacent interconnects by providing a reference potential that prevents signal distortion and noise propagation.
2Device complexity
If peripheral devices and memory arrays are placed in close proximity in a stacked architecture, then device integration is improved, but coupling effects between circuits increase causing signal distortion
Solution Approach 1:
The shielding layer serves as a physical and electrical intermediary positioned between the peripheral devices and memory arrays. By introducing this intermediate structure with grounding capability, the direct coupling path between adjacent circuits is interrupted, reducing the harmful coupling effects while maintaining the integrated stacked architecture.
Solution Approach 2:
The harmful coupling effect is extracted and redirected to ground through the shielding layer's conduction region. By providing a dedicated grounding path, the electromagnetic interference that would otherwise couple between circuits is extracted and dissipated, isolating the functional circuits from each other's interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding layer effectively reduces signal distortion and maintains signal integrity by minimizing the coupling effect between interconnects in 3D memory devices, improving the performance and efficiency of the memory operation.
Implementation Method 1
a shielding layer disposed between the peripheral device and the plurality of memory strings. The shielding layer includes a conduction region configured to receive a grounding voltage during operation of the 3D memory device
Data Source
AI summary
A three-dimensional (3D) memory device includes a peripheral device, a plurality of memory strings, a layer between the peripheral device and the plurality of memory strings, and a contact. The layer includes a conduction region and an isolation region. The contact extends through the isolation region of the layer.