3D Metal Pattern Transfer to Flexible Substrates

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Solution Overview

Problem

Existing methods face challenges in transferring a three-dimensional metal pattern to flexible substrates while maintaining durability against heat and solvents, as flexible substrates have poorer durability compared to hard glass-based substrates, and there is a need for technologies that can form durable 3D metal structures for flexible electronic devices.

Innovation Solution

A method involving a film with a photothermal conversion layer, an intermediate layer with low surface energy, and a metal layer, where the photothermal conversion layer absorbs light to convert it into heat, causing volume expansion and transferring the metal layer onto a receptor, using materials like dyes, carbon black, metal oxides, or sulfides, and fluorine- or silicon-based compounds to ensure effective transfer of a continuous metal pattern with a 3D structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a metal pattern is transferred to a flexible substrate using conventional methods, then the metal electrode can be formed, but the flexible substrate shows poorer durability to heat and solvent compared to hard substrates

Engineering Contradiction:

Improvesubstrate flexibilityVSAvoiddurability to heat and solvent

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The invention divides the metal layer into multiple thin metal layers (first metal layer, second metal layer, third metal layer) with an organic electroluminescent layer positioned between them. This segmentation allows each metal layer to be thinner and less stressed, while the layered structure distributes thermal and mechanical stress, improving overall durability on flexible substrates without compromising the flexibility advantage.

Inventive Principle:

Principle #1Segmentation

2Reliability

If a 3D metal pattern is formed on a flexible substrate, then durability against bending and stretching is improved, but it is difficult to maintain the 3D shape during transfer

Engineering Contradiction:

Improvedurability against bending and stretchingVSAvoidintegrity of 3D structure transfer

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The 3D metal pattern is divided into multiple thin metal layers (first, second, and third metal layers) separated by an organic electroluminescent layer. This segmentation allows the 3D structure to be built up in stages, with each layer being easier to transfer individually while maintaining the overall 3D shape. The intermediate organic layer acts as a buffer that prevents structural collapse during the transfer process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses thin film structures for both the metal layers and the organic electroluminescent layer. These thin films are flexible enough to conform to the flexible substrate while maintaining the 3D pattern structure. The thin film nature allows the structure to bend and stretch without breaking, preserving the 3D shape during and after transfer.

Inventive Principle:

Principle #30Flexible shells and thin films

3Shape

If multiple layers are stacked to form a 3D metal pattern, then the 3D structure can be achieved, but the transfer process becomes more complex

Engineering Contradiction:

Improve3D structureVSAvoidtransfer process complexity

Core Design Contradiction:

ShapeVSDevice complexity

Solution Approach 1:

The invention combines multiple metal layers and the organic electroluminescent layer into a single integrated structure that is transferred as one unit. The layers are positioned in specific relationships (first metal layer, then organic layer, then second and third metal layers) and transferred together, simplifying the overall process compared to transferring each layer separately while still achieving the 3D structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the rapid and effective transfer of a metal pattern with a 3D structure onto flexible substrates, ensuring durability against bending and stretching, and can be used for forming electrode layers and interconnection lines in flexible electronic devices.

Implementation Method 1

a photothermal conversion layer; an intermediate layer having a surface energy of 25 mN/m or less; and a metal layer; and transferring an entire continuous metal layer having an uneven structure to the receptor by irradiating the photothermal conversion layer with light

Methodology Applied

Scientific EffectPhotothermal conversion: Absorption (EM radiation)

Implementation Method 2

the photothermal conversion layer comprises a dye, carbon black, a metal, a metal oxide, or a metal sulfide

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP3028850B1Method for manufacturing metal pattern of three-dimensional structure

Publication Date: 2019.10.02 LG CHEM LTD

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AI summary

The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate. According to the method of preparing a metal pattern, the metal pattern having a 3D structure can be effectively formed on a receptor. Especially, the metal pattern having a 3D structure can also be effectively and rapidly transferred to a surface of the receptor, such as, a flexible substrate, to which the metal pattern is not easily transferred. The metal pattern laminate prepared using the method can, for example, be usefully used for metal layers of flexible electronic devices or metal interconnection lines.