Circuit Bendability/Stretchability TRIZ Cases

A flexible printed circuit board uses bent portions to overlap, reducing connector space and increasing component mounting area.

A segmented transmission cable design combines distinct unbendable and bendable regions to improve mechanical flexibility.

A flexible circuit board uses insulating members with low thermal expansion coefficients to suppress warpage during component mounting.

A stretchable wire member uses a multilayer body with controlled elastic modulus to maintain fabric stretchability.

Covalent bonding prevents delamination under high strain, resolving stability versus adaptability contradictions in stretchable electronics.

Dual potting agent configuration protects flexible printed wiring board connections using layered materials with distinct mechanical properties.

Segmented adhesive layers combine rigid impact absorption with flexible bending zones to protect internal components from external damage.

A releasable adhesive enables circuit component recovery from substrates under specific thermal or solvent conditions.

Photothermal conversion layer transfers 3D metal patterns onto flexible substrates, maintaining durability against heat and solvents.

Cover layers bridge the discontinuous substrate region to prevent moisture infiltration while maintaining air permeability.

A folded flexible printed circuit board unit with a bent joint portion and relay unit.

Conductive paste blocks fill through holes before copper plating, preventing bubble formation and ensuring complete via connectivity.

A circuit board defines a hot pressing area to improve heat transmission, preventing brittle sintered interfaces in thermocompression soldering.

Varying conductor width and curvature radius distribute stress uniformly, reducing maximum strain during repeated bending.

Via-connected gel electrodes on a stretchable substrate reduce interface resistance and body stress during movement.

Liquid-phase conductive structures in insulating layers maintain electrical connectivity under stress, solving stretchability reliability trade-offs.

Molded packaging member covers electrical components on flexible circuit board, reducing thickness and weight of electronic devices.

A printed circuit board design segments the ground layer into parallel sections with varying metal member areas to manage structural integrity.

Flexible PCB pressure sensor uses Wheatstone bridge resistors to convert mechanical deformation into electrical signals.

Liquid metal circulating in stretchable circuit conduits transfers heat to external sinks, maintaining safe operating temperatures for skin-worn devices.

Segmented wires with elevated intermediate segments withstand horizontal and vertical deformations on flexible substrates.

An insulating layer with an inclined face directs reflected exposure light away from wiring patterns on a metal thin film.

Hermetic sealing prevents moisture ingress and corrosion during high-pH sterilization cycles, extending device reliability.

A flexible plate with a bonding portion and spaced holding portion attaches to a coverlay.

Grooved PCB areas balance weight disparities between sensors and under-panel sheets to maintain adhesion reliability.

Curved flexible polymer electrode array with protective skirt reduces pressure and prevents tissue damage.

Optical blocking body made of black heat conducting silica gel prevents ambient light from reaching the photosensitive chip.

Varying via hole cross-sectional areas in PCB bending regions disperses mechanical stress, preventing cracks and ensuring prolonged device lifespan.

Filling substrate recesses with a capillary-index-controlled polysilazane layer prevents delamination and optical defects.

A multilayer rigid flexible printed circuit board integrates a laser blocking layer on the flexible region to protect circuit patterns during manufacturing.

An intaglio structure protects interconnection lines from damage during bending, enabling thinner circuit boards and reduced bezel width in display devices.

Segmented film layers protect circuits from deformation stress, preventing capacitance errors in flexible wearables.

Wrapping flexible circuits into tubular structures reduces component stack thickness while maintaining electrical connectivity.

Variable fiber density in the reinforced layer disperses bending stress, preventing circuit dislocation and extending the bending life of bendable displays.