Wired Circuit Board Inclined Face Light Reflection Control
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Solution Overview
Problem
Existing methods for producing small-sized wired circuit boards with high-density wiring patterns fail to prevent short circuits, as they do not maintain the required angle between wiring directions, leading to reflections that affect exposure light and cause pattern disruptions.
Innovation Solution
A method involving an insulating layer with an inclination face, a metal thin film, and a photoresist, where a photomask is positioned to ensure that at least a portion of the light exposure portions overlap with a virtual circle, focusing reflected light away from the wire areas to prevent short circuits, while allowing high-density wire placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wiring patterns are disposed with high density, then productivity and miniaturization are improved, but short circuit occurs due to light reflection affecting exposure precision
Solution Approach 1:
The invention converts the harmful light reflection from the boundary face into a beneficial effect by designing the boundary face with a specific inclination angle (45° to 60°). This angle causes the reflected light to be directed away from the wiring pattern formation area, transforming the potential defect into a solution that enables high-density wiring without short circuits.
Solution Approach 2:
The invention changes the geometric parameter of the boundary face by forming it with a specific inclination angle relative to the top face of the insulating layer. This parameter change (angle configuration) modifies the light reflection path, preventing reflected light from affecting the exposure process and thereby maintaining manufacturing precision even with high wiring density.
2Area of stationary object
If wiring patterns are disposed with high density, then the size of the circuit board is reduced, but short circuit cannot be prevented due to light reflection
Solution Approach 1:
The invention converts the harmful light reflection into a beneficial directional control mechanism by setting the boundary face inclination angle between 45° and 60°. This transforms the reflection from a source of defects into a tool for controlling light paths, thereby preventing short circuits while enabling compact circuit board design.
Solution Approach 2:
By changing the inclination angle parameter of the boundary face to specifically 45° to 60°, the invention controls the reflection geometry to prevent light from reaching adjacent wiring patterns. This parameter optimization allows high-density wiring layout without compromising reliability.
3Shape
If the boundary face is formed between different thickness portions, then the insulating layer structure is improved for wiring support, but light reflection causes exposure light to be affected
Solution Approach 1:
The invention applies local quality by giving the boundary face a specific inclination angle (45° to 60°) only at the transition region between different thickness portions, while keeping other areas flat. This localized geometric modification controls light reflection precisely where the thickness change occurs, maintaining the structural advantage while eliminating the harmful reflection effect.
Solution Approach 2:
The invention changes the geometric parameter of the boundary face from a vertical or arbitrary angle to a specific inclination angle range (45° to 60°). This parameter change optimizes the light reflection path, directing reflected light away from the exposure area while preserving the stepped structure's ability to support high-density wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents short circuits between wires by isolating the light-focused portions, ensuring that the wires can be placed with high density without causing short circuits, thereby enhancing the reliability of the wired circuit board production.
Implementation Method 1
the reflected light reflected at the metal thin film corresponding to the arc is focused on the photoresist corresponding to the center of the virtual circle along the are
Implementation Method 2
the reflected light reflected at the metal thin film corresponding to the arc is focused on the photoresist corresponding to the center of the virtual circle along the are
Data Source
AI summary
In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.