Multilayer Rigid Flexible PCB Laser Blocking Layer Design
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Solution Overview
Problem
Current methods for manufacturing multilayer rigid flexible printed circuit boards face challenges in efficiently integrating flexible and rigid regions using a rigid build-up substrate process, particularly in protecting circuit patterns and managing electromagnetic interference.
Innovation Solution
A multilayer rigid flexible printed circuit board is manufactured by forming a flexible region with a laser blocking layer and an optional electromagnetic shielding layer, which includes an adhesive, polyimide layer, and copper foil, and a rigid region with stacked pattern layers, allowing for electrical connections and electromagnetic shielding, while extending these layers to via holes and through holes for protection and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rigid build-up substrate process is used to manufacture multilayer rigid flexible printed circuit boards, then manufacturing efficiency and cost are improved, but the ability to protect circuit patterns and manage electromagnetic interference in the flexible region deteriorates
Solution Approach 1:
The circuit board is divided into flexible and rigid regions, with the flexible region using a flexible substrate and the rigid region using a rigid substrate. This segmentation allows each region to be optimized independently - the flexible region can use laser stoppers for circuit pattern protection while the rigid region benefits from the rigid build-up process, resolving the contradiction between manufacturing efficiency and circuit pattern protection.
Solution Approach 2:
Different materials and structures are applied to different regions of the circuit board. The flexible region incorporates laser stoppers made of specific materials (such as black polyimide or metal layers) to protect circuit patterns from laser damage during manufacturing, while the rigid region uses standard rigid substrate construction. This local differentiation enables both manufacturing efficiency and circuit pattern protection to be achieved in their respective regions.
2Ease of manufacture
If a rigid build-up substrate process is used to manufacture multilayer rigid flexible printed circuit boards, then manufacturing efficiency and cost are improved, but electromagnetic shielding capabilities deteriorate
Solution Approach 1:
The circuit board employs asymmetric construction where the flexible region includes electromagnetic shielding layers (such as copper foil layers or conductive coatings) that are not present in the rigid region. This asymmetric design allows the flexible region to have enhanced electromagnetic shielding capabilities while the rigid region maintains manufacturing efficiency through the rigid build-up process.
Solution Approach 2:
Electromagnetic shielding layers are incorporated into the flexible region during the manufacturing process, before the board is put into service. The shielding layers (such as copper foil or conductive coatings) are applied in advance to prevent electromagnetic interference, allowing the board to maintain both manufacturing efficiency and electromagnetic shielding capabilities.
3Reliability
If traditional manufacturing methods are used for multilayer rigid flexible printed circuit boards, then circuit pattern protection is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The laser stopper structure serves multiple functions: it protects circuit patterns from laser damage during manufacturing, provides structural support in the flexible region, and can also contribute to electromagnetic shielding when made of conductive materials. This multi-functionality reduces manufacturing process complexity while maintaining circuit pattern protection, as a single structure accomplishes multiple protective and structural roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances the board's flexibility and electromagnetic shielding capabilities, enabling the use of existing rigid substrate production lines without significant modifications.
Implementation Method 1
a laser blocking layer formed on the circuit pattern
Implementation Method 2
an adhesive coated on the circuit pattern formed on the flexible film, a polyimide layer formed on the adhesive
Implementation Method 3
a copper foil layer formed on the polyimide layer
Data Source
AI summary
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.