Circuit Board Bending Protection for Thin Bezel Displays
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Solution Overview
Problem
The thinning of circuit board structures in liquid crystal display devices leads to damage of interconnection lines in bending portions, necessitating a solution to prevent wiring damage while maintaining a reduced bezel width.
Innovation Solution
The implementation of an interconnection line arrangement portion crossing at right angles with a protection portion on the periphery, forming a bending hole with an intaglio structure, and using a dummy metal with an adhesive layer to create a protective embossed or stepped structure to absorb impact and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the circuit board structure is thinned to reduce bezel width, then the bezel width is reduced, but the interconnection lines in bending portions are damaged
Solution Approach 1:
An intaglio structure (recessed groove) is formed in the circuit board at the bending portion before the interconnection lines are routed through it. This pre-formed cushioning structure allows the interconnection lines to nestle into the recessed area during bending, preventing them from being damaged by the bending stress while enabling the circuit board to be thinned for reduced bezel width.
2Length of stationary object
If the circuit board is made thinner, then the bezel width is reduced, but the structural strength to protect interconnection lines is insufficient
Solution Approach 1:
Instead of uniformly thickening the entire circuit board, the patent applies a localized intaglio structure (recessed groove) specifically at the bending portion where interconnection lines are vulnerable. This local quality enhancement provides targeted protection exactly where needed, maintaining overall thinness while ensuring structural strength at critical locations.
Data Source
AI summary
Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.