Conductive Module Dual Potting Agent Stress Absorption
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Solution Overview
Problem
The existing conductive modules with flexible printed wiring boards lack effective protection for the connection parts between electronic components and the flexible printed wiring boards, leading to potential damage from external stress, thermal expansion, and mechanical vibrations.
Innovation Solution
A conductive module design incorporating a flexible first potting agent that covers the connection part between the electronic component and the flexible printed wiring board, and a harder second potting agent that overlaps the first agent from the opposite side, providing dual-layer protection with the first agent having higher flexibility to absorb stress and the second agent offering rigidity against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a single rigid potting agent is used to protect the connection part, then protection against external impacts is improved, but stress from thermal expansion and mechanical vibrations cannot be absorbed, leading to connection damage
Solution Approach 1:
The potting agent is divided into two distinct layers: a first potting agent layer closer to the connection part and a second potting agent layer on the opposite side. Each layer has different properties - the first layer has higher flexibility to absorb stress, while the second layer provides rigid protection against external impacts. This segmentation allows each layer to perform its specific function optimally.
Solution Approach 2:
Different regions of the potting structure are assigned different material properties. The first potting agent layer (near the connection part) is designed with higher flexibility to locally absorb thermal expansion and vibration stress. The second potting agent layer (on the opposite side) is designed with higher rigidity to locally provide impact protection. This local quality differentiation resolves the contradiction between needing rigidity for impact resistance and flexibility for stress absorption.
2Reliability
If a flexible potting agent is used to absorb thermal expansion stress, then connection reliability is improved, but protection against external mechanical stress and impacts is insufficient
Solution Approach 1:
The protective structure is segmented into two functional layers. The first layer (flexible potting agent) is positioned to primarily handle thermal expansion and vibration stress absorption. The second layer (rigid potting agent) is positioned to primarily handle external impact protection. This segmentation allows each material to be optimized for its specific function without compromise.
Solution Approach 2:
The patent employs a composite structure combining two different potting agents with contrasting mechanical properties. The flexible potting agent (e.g., silicone rubber) provides stress absorption, while the rigid potting agent (e.g., epoxy resin) provides structural protection. This composite approach allows the system to simultaneously achieve both flexibility for reliability and rigidity for strength.
3Device complexity
If no potting agent is used, then device complexity is reduced, but the connection part is exposed to damage from thermal expansion, vibrations, and external stress
Solution Approach 1:
Rather than using a single complex protective structure, the patent segments the protection into two simple layered potting agent applications. This segmented approach maintains relative structural simplicity while providing comprehensive protection against multiple types of stress (thermal, vibrational, and mechanical impacts).
Solution Approach 2:
The patent uses a composite of two potting agents applied in layers, which can be manufactured using standard processes. This composite structure provides enhanced protection without significantly increasing manufacturing complexity, as both layers can be applied using conventional potting techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-potting agent configuration effectively reduces stress on electrical connections, enhances reliability by absorbing thermal expansion and contraction, and protects against external mechanical stress and vibrations, improving the durability of the conductive module.
Implementation Method 1
enhances reliability by absorbing thermal expansion and contraction
Implementation Method 2
effectively reduces stress on electrical connections
Implementation Method 3
the second agent offering rigidity against external impacts
Data Source
AI summary
A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.