Printed Circuit Board Warpage Control via Ground Layer Segmentation
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Solution Overview
Problem
As electronic devices become smaller and thinner, printed circuit boards face challenges in controlling warpage due to their reduced thickness and width, making it difficult to maintain structural integrity and functionality.
Innovation Solution
The printed circuit board design incorporates a ground layer with metal members arranged in parallel, where the areas of these metal members vary between sections to adjust for gaps and intersecting linear structures, allowing for better control of warpage by optimizing the distribution of metal and insulating layers, and includes a combination of rigid and flexible portions to manage stress and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the printed circuit board thickness and width are minimized for better space utilization, then the space utilization is improved, but the warpage control becomes difficult
Solution Approach 1:
The ground layer is divided into multiple ground layer sections with different metal member areas. Specifically, the first ground layer section has a larger metal member area than the second ground layer section, creating local variations in metal distribution. This non-uniform metal area distribution compensates for warpage in specific regions of the thin printed circuit board, addressing the warpage control issue while maintaining the minimized overall thickness and width for space utilization.
2Stability of the object's composition
If the metal member areas are made non-uniform across ground layer sections, then the warpage control is improved, but the manufacturing complexity increases
Solution Approach 1:
The ground layer is segmented into multiple ground layer sections (first ground layer section, second ground layer section, etc.) arranged in parallel. Each section contains metal members with specific area relationships (first area > second area). This segmentation approach allows for controlled variation in metal distribution to manage warpage, while the systematic arrangement of segments provides a manageable manufacturing process despite the non-uniform metal areas.
Data Source
AI summary
A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.