Integrated Circuit Board Molding for Lightweight Design
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Solution Overview
Problem
The size of integrated circuit boards has become a bottleneck in the lightweight design of electronic devices, restricting the development of smaller and more compact electronic devices.
Innovation Solution
The integrated circuit board design includes a flexible circuit board with a packaging member that completely covers electrical components, reducing the need for a separate printed circuit board and incorporating a reinforcing plate, allowing for a molding process to control the size and shape of the packaging member, thereby minimizing the overall thickness, width, and length of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a conventional integrated circuit board structure including printed circuit board, flexible circuit board, and packaging member is used, then the board provides adequate structural support and component protection, but the thickness increases and lightweight design is restricted
Solution Approach 1:
The patent combines the flexible circuit board and packaging member into an integrated structure where the packaging member is molded directly onto the flexible circuit board, eliminating the need for a separate printed circuit board. This merging reduces the total number of layers and thickness while maintaining structural support and component protection functions.
Solution Approach 2:
The patent changes the structural parameters by removing the rigid printed circuit board layer and relying on the molded packaging member to provide both protection and structural support. This parameter change reduces the overall thickness and weight while adequate support is maintained through the molded structure design.
2Volume of moving object
If the integrated circuit board size is reduced for lightweight design, then electronic devices become more compact, but the risk of pin deformation and welding failures increases
Solution Approach 1:
The patent incorporates a reinforcing plate during the molding process to pre-strengthen the extension part where connecting members are located. This preliminary reinforcement prevents pin deformation and welding failures even when the overall board size is reduced, as the reinforcing structure is built in advance during manufacturing.
Solution Approach 2:
The patent uses a composite structure combining the flexible circuit board, molded packaging member, and reinforcing plate. This composite design provides both size reduction and enhanced mechanical strength to prevent pin deformation and welding failures in the compact configuration.
3Strength
If a separate printed circuit board is used for structural support, then the board maintains adequate strength and stability, but the overall thickness and weight increase
Solution Approach 1:
The patent merges the structural support function previously provided by the separate printed circuit board into the molded packaging member. The packaging member is designed to provide both component protection and structural support, eliminating the need for an additional board layer and reducing overall thickness.
Solution Approach 2:
The molded packaging member serves multiple functions: it protects electrical components, provides structural support, and maintains board stability. This multi-functional design replaces the need for separate structural support layers, reducing thickness while maintaining adequate strength.
Data Source
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AI summary
This application provides an integrated circuit board, a battery module, an electronic device, and an integrated circuit board preparation method. The integrated circuit board includes a flexible circuit board, a first electrical component, a second electrical component, a connecting member, a reinforcing plate, and a packaging member. The flexible circuit board includes a body part and an extension part that are connected in a length direction of the integrated circuit board. The first electrical component and the second electrical component are respectively disposed on two opposite sides of the body part. The connecting member and the reinforcing plate are respectively disposed on two opposite sides of the extension part. In a thickness direction of the integrated circuit board, a projection of the reinforcing plate on the extension part and a projection of the connecting member on the extension part overlap at least partially. The packaging member is fastened to the body part, and the packaging member completely covers the first electrical component. In the thickness direction of the integrated circuit board, both a projection of the second electrical component and a projection of the body part are completely located on the packaging member. The thickness of the integrated circuit board is reduced, which facilitates lightweight design of the electronic device.