PCB Groove Design for Sensor Integration and Adhesion
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Solution Overview
Problem
The integration of sensors with printed circuit boards (PCBs) in display devices often results in weight differences due to height disparities with under-panel sheets, leading to reduced adhesion and potential damage to the PCB.
Innovation Solution
A PCB design featuring a first area for the sensor, a second area for the under-panel sheet, and connecting portions thinner than both, with grooves and openings to accommodate the sensor and ensure flexibility, thereby minimizing weight differences and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sensor is mounted directly on the PCB, then the sensor can be integrated into the display device, but the height difference between the sensor and under-panel sheet causes weight difference which reduces adhesion and can damage the PCB
Solution Approach 1:
The PCB is designed with non-uniform thickness: a first area with a first thickness for mounting the sensor, a second area with a second thickness for the under-panel sheet, and connecting portions with a third thickness (smaller than both first and second thicknesses) connecting them. This local variation in thickness creates corresponding weight differences that compensate for the height disparity between sensor and under-panel sheet, thereby maintaining adhesion reliability.
Solution Approach 2:
The invention changes the physical parameter of PCB thickness in different regions to create a weight balance. By making the connecting portions thinner than both the first and second areas, the design creates a stepped structure that compensates for the height difference between mounted components, resolving the adhesion problem caused by uneven weight distribution.
2Adaptability or versatility
If the sensor is mounted directly on the PCB, then the sensor can be integrated into the display device, but the height difference between the sensor and under-panel sheet can damage the PCB
Solution Approach 1:
The PCB employs localized thickness variation where the first area (sensor mounting area) and second area (under-panel sheet area) have different thicknesses, connected by thinner connecting portions. This creates a stepped structure that accommodates the height difference between components, preventing stress concentration and potential damage to the PCB while maintaining overall structural integrity.
Solution Approach 2:
The thinner connecting portions act as cushioning elements that absorb and distribute the stress caused by height differences between the sensor and under-panel sheet. This pre-designed stress distribution mechanism prevents sudden failures and protects the PCB from damage before it occurs.
3Adaptability or versatility
If the connecting portions are made thinner, then flexibility in the vertical direction is enhanced, but the structural strength may be reduced
Solution Approach 1:
The connecting portions are designed with a specific third thickness that is smaller than both the first and second thicknesses, creating an optimized balance between flexibility and strength. This localized thinning provides the necessary vertical flexibility to accommodate component height differences while maintaining sufficient structural strength through the overall PCB design and material properties.
Data Source
AI summary
Provided are display devices. The display device comprises: a printed circuit board (PCB); an under-panel sheet which is disposed on the PCB and in which a groove recessed from a surface facing the PCB toward an opposite surface is defined; and a sensor which is disposed on the PCB and in the groove, wherein one or more openings are defined in the PCB in plan view, and the PCB comprises a first area and a second area divided by the openings interposed between the first area and the second area, wherein the first area is an area where the sensor is disposed, and the second area is an area where a portion of the under-panel sheet in which the groove is not defined is disposed.