3D Microcrystalline Cooling Structure for High-Heat AI Chips
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Solution Overview
Problem
Existing heat dissipation technologies for high heat sources, such as AI chips, are inefficient due to poor heat conduction performance of metal plates in liquid cooling systems, failing to meet the demand for enhanced heat dissipation efficiency.
Innovation Solution
A 3D microcrystalline heat dissipation device utilizing a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity, with microcrystalline copper powder electroplating layers, to facilitate gas-liquid phase change and rapid heat transfer through refrigerant flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to dissipate heat from high heat sources, then heat dissipation capacity is improved, but heat dissipation efficiency deteriorates due to poor heat conduction performance of the metal plate
Solution Approach 1:
The patent uses a porous metal foam heat conduction plate instead of a traditional solid metal plate. The metal foam structure provides numerous micro-channels and pores that significantly increase the surface area for heat transfer between the heat source and the refrigerant, thereby improving heat dissipation efficiency while maintaining high heat dissipation capacity
Solution Approach 2:
The patent utilizes the phase transition (evaporation and condensation) of refrigerant within the metal foam structure. The refrigerant absorbs heat from the heat source through phase change in the porous channels, then releases heat externally, creating a highly efficient heat transfer cycle that overcomes the limitations of conventional metal plate heat conduction
2Loss of energy
If heat dissipation fins are used to increase heat dissipation area, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent transitions from traditional 2D heat dissipation fins to a 3D porous metal foam structure. The metal foam provides three-dimensional heat transfer pathways throughout the entire volume of the heat conduction plate, enabling heat dissipation in multiple directions simultaneously and eliminating the need for external fin structures
Solution Approach 2:
The patent merges the heat conduction function and heat dissipation function into a single integrated metal foam heat conduction plate. The porous structure simultaneously serves as both the heat conduction medium and the heat dissipation surface, eliminating the need for separate heat dissipation fins and simplifying the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves efficient heat dissipation by conducting heat from the heat source to the liquid flow heat dissipation cavity through gas-liquid phase change, significantly improving heat dissipation efficiency compared to traditional methods.
Implementation Method 1
the heat of the heat source is conducted to the liquid flow heat dissipation cavity through the gas-liquid phase change of the capillary phase change heat conduction cavity
Implementation Method 2
capillary phase change heat conduction cavity
Implementation Method 3
the liquid flow heat dissipation cavity quickly brings heat to the outside through the flowing refrigerant
Implementation Method 4
the bottom surface of the interior of the liquid flow heat dissipation cavity having the immersed microcrystalline structure is provided with the microcrystalline copper powder electroplating layer
Data Source
AI summary
A 3D microcrystalline heat dissipation device comprising a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity that are attached to each other. The capillary phase change heat conduction cavity is configured to be a sealing structure, and the liquid flow heat dissipation cavity is hermetically connected to a liquid inlet pipe and a liquid outlet pipe. The liquid flow heat dissipation cavity has an immersed microcrystalline structure. The bottom surface of the interior of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer. The heat of the heat source is conducted to the liquid flow heat dissipation cavity through the gas-liquid phase change of the capillary phase change heat conduction cavity, and then the liquid flow heat dissipation cavity quickly brings heat to the outside through the flowing refrigerant, so that efficient heat dissipation is achieved.