Cooling/Ventilation/Heating Modifications TRIZ Cases

Auxiliary bubbles drive coolant circulation through immersed servers, improving heat transfer while cutting motor load and PUE impact.

Counter-flow cooling channels between and outside stacked power modules limit thermal overlap and support high-output conversion.

A shared coolant manifold, valves, and weir keep flow and liquid levels balanced across immersion racks to prevent air intake and overheating.

Phase-change material stores server heat and shifts cooling load to lower-cost or renewable power periods, cutting data center energy use.

Rear ports routed through fan slots and a sealed air dam raise switch port density while preserving cable access and thermal management.

Dual flow circuits and shared manifolds cool aircraft power modules with redundancy, cutting weight and complexity while sustaining operation.

An external coolant flow path and heat pipe move heat out of the housing, cutting enclosure size, sealing needs, and leakage risk.

Two insulating elements of different rigidities extend creepage and clearance paths around a cooled electronic module without increasing package size.

Auxiliary bubbles drive coolant circulation through immersed servers, easing fluid resistance and reducing motor power while maintaining cooling.

A sealed fluid-filled enclosure and thermally conductive mass passively remove heat from vehicle electric devices without bulky active cooling.

Stored refrigerant and a solenoid-switched loop provide immediate backup cooling during data center power outages to prevent chip overheating.

Porous drip trays redirect condensation droplets away from the coolant surface, preserving two-phase immersion cooling efficiency.

Side-wall fluid risers and fin-guided flow keep server cold plates low profile while preserving hose access and heat removal.

Welded mounting blocks and channels keep server rack manifold ports aligned despite tolerances and deformation, preventing coolant leaks.

Varying fin wavelengths along coolant flow improve temperature uniformity while limiting pressure drop and pump energy in EV inverter cooling.

Redirected airflow from adjacent fans keeps power components cooled during fan replacement or failure while increasing arc path length.

Parallel cooling channels aligned to LED areas reduce temperature differences, stabilizing irradiation and extending element life.

Parallel coolant paths and pin fin plates cool stacked power modules in tight spaces while improving temperature uniformity and thermal resistance.

Collision pillars and segmented water-air cooling improve thermal mixing and heat dissipation without enlarging the heat sink.

A dual-loop liquid cooling layout uses immersion, cold plates, and a heat exchanger to cool dense electronic modules with less complexity.

An in-casing heat exchanger cools both airflow and coolant before discharge, cutting room heat rise and air-conditioner load.

A central-port water path and microfins spread cooling more evenly across hashboard chips, reducing hotspots and maintenance in mining rigs.

Thermally isolated rack cooling uses modular refrigerant loops to cut data center air-handling losses and simplify maintenance.

Varying sinusoidal fin wavelengths along coolant flow balances heat transfer and pressure drop for more uniform EV power module temperatures.

Welded mounting blocks and channels keep server rack manifold ports aligned despite tolerances and loads, reducing leaks and install errors.

Capillary phase change and flowing refrigerant overcome poor metal-plate conduction to cool high-heat AI chips more efficiently.

A sealed heat exchanger and phase-change block stabilize electronics temperature without outside airflow, blocking sand and dust intrusion.

Capillary-fed porous cooling stabilizes two-phase heat dissipation by venting vapor bubbles and preventing local dry-out.

A closed-loop coolant and air-convection layout uses seawater heat exchange to avoid marine fouling maintenance while keeping server racks cool.

Actively controlled manifolds redirect coolant to predicted or sensed hotspots, improving electronic cooling without constant over-cooling.

Submerged gas outlets create bubble-driven convection in immersion fluid, improving electronic heat removal without external exchangers.

A phase-change heat transfer compound provides temporary passive cooling when external cooling fails, preventing electronic overheating and damage.

An angled duct plate and fan channel airflow over camera circuit boards to remove heat while keeping the image capturing body compact.

Progressively angled baffles redirect CDU fan airflow to cut hot-aisle turbulence, pressure drop, and cooling energy use.

Pump speed tracks temperature and workload to cool dense electronic arrays without flow-control valves, cutting cooling energy use.

Stored compressed air drives a pneumatic fluid mover to sustain short-term data center cooling during utility failures and generator startup.

Thin thermal pads and aluminum plates move heat from dual-side IC chips to the housing and touchscreen, limiting overheating without bulky heat sinks.

Variable fin densities around EV power module heat sources improve coolant flow and deliver more uniform, rapid heat removal.

A sealed heat sink and non-conductive bag let ordinary water cool electronic components directly while improving maintenance and avoiding PFAS.

An insert between the power module and coolant wall improves heat transfer uniformity, reducing thermal stress in on-board chargers.

A sealed heat-exchanger loop uses seawater only as an external heat sink, avoiding filter maintenance while keeping underwater server racks cooled.