Variable-Speed Liquid Cooling Pumps for Data Center Workloads

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Solution Overview

Problem

Existing cooling systems for data centers and high-density electronic arrays are energy-inefficient and struggle to provide optimal cooling, particularly for closely spaced components, leading to significant energy consumption by both the electronic devices and cooling systems.

Innovation Solution

Implementing variable speed coolant pumps that adjust flow rates based on cooling demands, eliminating the need for flow control valves, and using predictive and reactive control to optimize cooling and reduce energy consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If forced air convection is used for cooling electronic devices, then cooling effectiveness is improved for individual devices, but cooling becomes insufficient for large clusters or arrays of closely spaced devices

Engineering Contradiction:

Improvecooling effectivenessVSAvoidapplicability to device clusters

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The system segments the cooling approach by transitioning from air-based convection to liquid-based cooling, where the liquid coolant can be delivered through conduits directly to closely spaced electronic devices in clusters, enabling effective cooling in high-density configurations where air convection fails

Inventive Principle:

Principle #1Segmentation

2Temperature

If liquid coolant circulation is implemented for cooling device clusters, then cooling effectiveness for closely spaced devices is improved, but energy consumption increases significantly

Engineering Contradiction:

Improvecooling effectivenessVSAvoidenergy consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The system employs variable speed coolant pumps that can dynamically adjust their operating speed based on cooling demands. The controller receives temperature measurements and workload information, then modulates pump speed to provide optimal cooling while minimizing energy consumption, allowing the system to scale cooling capacity from 0% to 100% as needed

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system implements feedback control by continuously monitoring temperature measurements from sensors located near or within electronic devices, along with workload information from system administrators or automated sources. This feedback is used by the controller to adjust coolant flow rates and pump speeds in real-time, optimizing the balance between cooling effectiveness and energy consumption

Inventive Principle:

Principle #23Feedback

3Temperature

If maximum cooling capacity is maintained continuously, then cooling effectiveness is ensured, but energy consumption increases unnecessarily during low workload periods

Engineering Contradiction:

Improvecooling effectivenessVSAvoidwasted energy

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The system applies partial cooling action by allowing coolant flow to be reduced below maximum capacity when full cooling is not required. The variable speed pumps can operate at reduced speeds during low workload periods, providing just enough cooling to maintain safe temperatures without the excessive energy consumption of continuous maximum-capacity operation

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system provides optimal cooling while reducing energy consumption by dynamically adjusting coolant flow rates, enhancing device longevity and operational stability through predictive workload anticipation.

Implementation Method 1

the coolant is delivered as a cooling liquid to the electronic devices 100 by a liquid coolant pump 106. Heat from the electronic devices 100 is thereby absorbed

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the coolant is delivered as a cooling liquid to the electronic devices 100 by a liquid coolant pump 106. Heat from the electronic devices 100 is thereby absorbed and delivered to a heat transfer apparatus 108

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

Heat from the electronic devices 100 is thereby absorbed and delivered to a heat transfer apparatus 108, where the heat is transferred to a radiator, cooling tower, or other heat dissipation device

Methodology Applied

Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS20260020192A1Adjustable liquid cooling of electronic devices by variable speed cooling pumps

Publication Date: 2026.01.15 FLOWSERVE PTE LTD

AI summary

A data center cooling system comprises a cooling loop through which a coolant is caused to flow to a plurality of electronic devices by a variable speed pump under control of a controller. Separate variable speed liquid and vapor pumps are provided in embodiments where the coolant is vaporized by the absorbed heat. In response to changing cooling requirements, the coolant flow rate is adjusted by varying the pump speeds, without reliance on a flow control valve. Cooling is thereby optimized while minimizing pump energy consumption. The cooling loop can be branched into flow paths, each of which can include a separately controlled isolation valve. A plurality of cooling loops can include dedicated, separately controlled variable speed pumps. The pumps can be controlled reactively according to temperature measurements, and/or predictively according to measured electrical current flows to the electronic devices and/or device workload predictions.