Immersion Cooling Gas Injection for Data Center Heat Removal
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Solution Overview
Problem
Conventional cooling systems for electronic components in data centers require extensive external cooling systems, which increase costs and potential failure points, and are inefficient in heat removal.
Innovation Solution
A gas injection system that uses a conduit to circulate compressed gas through a container holding a cooling fluid, with outlets submerged beneath electronic components to promote emulsification and vertical heat exchange, enhancing heat transfer efficiency without external exchangers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used with external cooling systems, then heat removal is achieved, but system complexity and cost increase
Solution Approach 1:
The patent extracts the cooling function from external cooling systems and integrates it directly into the immersion cooling container. Gas outlets are positioned beneath electronic components to create localized cooling zones, eliminating the need for separate external heat exchangers and reducing system complexity while maintaining effective heat removal.
Solution Approach 2:
The patent introduces gas bubbles as an intermediary medium between the cooling fluid and electronic components. The gas outlets release bubbles that rise through the cooling fluid, creating convection currents that enhance heat transfer from the electronic components to the cooling fluid without requiring external cooling equipment.
2Temperature
If gas injection is used to cool electronic components, then heat transfer efficiency improves, but system complexity increases
Solution Approach 1:
The patent applies pneumatic principles by using gas injection through conduits to create cooling effects. The pump circulates cooling fluid while gas outlets introduce gas bubbles beneath electronic components, utilizing fluid dynamics to enhance heat transfer without complex mechanical cooling systems.
Solution Approach 2:
The patent changes the physical parameters of the cooling system by introducing gas bubbles that alter the convection patterns of the cooling fluid. This parameter change enhances heat transfer efficiency through increased fluid motion and contact with electronic components, achieving better cooling with simpler equipment.
3Temperature
If outlets are positioned beneath electronic components, then localized cooling efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by positioning gas outlets specifically beneath electronic components that generate the most heat. This localized approach concentrates cooling effort where it is most needed, improving thermal management efficiency while the modular conduit design keeps manufacturing relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively removes heat from electronic components by emulsifying gas in the cooling fluid, maintaining efficient cooling without external exchangers, reducing failure risks and costs.
Implementation Method 1
The pump pressurizes and directs the cooling gas into and out of the conduit. The conduit is positioned downstream of the pump.
Implementation Method 2
The outlets are submersed in the first cooling fluid within the container and beneath the electronic components such that the cooling gas exits the conduit and enters the first cooling fluid.
Implementation Method 3
The container retains a first cooling fluid. The support suspends the electronic components in the container.
Implementation Method 4
A cooling gas is circulated through a cooling system... transporting the cooling gas into the container with the conduit
Data Source
AI summary
A system for cooling electronic components in a cooling fluid immersion environment includes a container, a support, a conduit, and a pump. The container retains a first cooling fluid. The support suspends the electronic components in the container. The conduit transports the cooling gas into the container. The conduit includes an inlet section, a middle section, and an outlet section. The inlet section includes a conduit inlet positioned outside of the container. The outlet section includes outlets. The outlet section is submersed in the first cooling fluid within the container and beneath the electronic components such that the cooling gas exits the conduit and enters the first cooling fluid. The pump pressurizes and directs the cooling gas into and out of the conduit. The conduit is positioned downstream of the pump.