On-Board Charger Power Module Cooling Insert for Uniform Heat Transfer
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Solution Overview
Problem
Existing onboard charging systems for electric vehicles face inefficiencies in cooling power modules, leading to non-homogeneous cooling and potential damage due to high thermal stress, particularly as charging power increases.
Innovation Solution
Incorporation of an insert within the cooling device that forms part of the coolant circuit, optimized for improved heat exchange between the power module and coolant, using materials with higher thermal conductivity and configured to enhance contact area and flow guidance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power modules are cooled by placing them in contact with the wall of a cooling circuit, then the cooling solution is simple to implement, but the cooling of electronic chips within the power module housing is not homogeneous and may not be sufficient in cases of high temperature rise
Solution Approach 1:
An insert is introduced as an intermediary element between the power module and the closing wall of the cooling circuit. This insert includes a heat exchange surface with pins or protrusions that extend into the coolant flow path, mediating heat transfer from the power module to the coolant. The insert acts as a thermal bridge that improves cooling effectiveness without requiring complex integration of the power module directly into the cooling wall.
Solution Approach 2:
The cooling solution transitions from a two-dimensional contact surface (power module against closing wall) to a three-dimensional heat exchange structure. The insert introduces vertical pins or protrusions that extend into the coolant flow, creating additional heat transfer surfaces in the third dimension (into the fluid flow path). This dimensional expansion significantly increases the effective heat exchange area and improves cooling homogeneity across the power module chips.
2Productivity
If charging power is increased to reduce charging times, then charging speed is improved, but heat output during charger operation increases
Solution Approach 1:
The cooling system utilizes the liquid phase of coolant to absorb and transport heat generated by high-power charging operations. The coolant circulates through the cooling circuit, absorbing thermal energy from the power module via the insert's heat exchange surface. This phase-based thermal management enables the system to handle the increased heat output from higher charging powers while maintaining operational safety and component reliability.
3Ease of manufacture
If power modules are positioned parallel to the direction of coolant flow, then the cooling solution is simple to implement, but heat exchange efficiency is reduced
Solution Approach 1:
The insert introduces curved or non-planar heat exchange surfaces in the form of pins or protrusions extending into the coolant flow. These three-dimensional features create turbulence and enhance convective heat transfer, improving heat exchange efficiency without requiring the power module itself to be repositioned or reoriented. The curved surfaces of the pins disrupt laminar flow patterns and increase thermal transfer effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insert optimizes heat exchange, ensuring uniform cooling of power modules and electronic chips, reducing thermal stress and preventing damage, while maintaining efficient coolant flow.
Implementation Method 1
The insert optimizes heat exchange, ensuring uniform cooling of power modules and electronic chips
Implementation Method 2
using materials with higher thermal conductivity and configured to enhance contact area
Implementation Method 3
a closing wall configured to rest against the receptacle to form with said channel a coolant circuit, said power module being secured to the closing wall in a power module positioning zone
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
Device comprising at least one housing (2), electronic components housed in said housing and among which at least one power module (20), the housing further housing a cooling device for at least one power module, the cooling device comprising a receptacle (6) which includes at least one coolant channel and a closing wall (8) configured to rest against the receptacle (6) to form with said channel a coolant circuit (10), said power module (20) being secured to the closing wall (8) in a positioning zone (Z1, Z2, Z3) of the power module,the cooling device being characterized in that the closing wall (8) comprises at least one opening (18) provided in said positioning zone and in that the cooling device comprises at least one insert (30) configured to be disposed in the opening (18) and to be interposed between the closing wall and the power module.