Hybrid Liquid Cooling Module With Heat Exchanger Segmentation
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Solution Overview
Problem
Existing cooling systems for electronic devices in IT equipment face challenges in efficiently managing increasing heat generation due to reduced footprint and higher computing performance, with air-cooled systems being limited and liquid-cooled systems being complex and costly.
Innovation Solution
A hybrid cooling system comprising a first immersive cooling circulatory arrangement and a second coolant loop with a heat exchanger, where the first coolant is contained within the module and the second coolant is either recycled or facility-supplied, with various configurations of heat exchanger and cooling module arrangements to optimize cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air-cooled systems are used to cool electronic modules, then the cooling system is simple and cost-effective, but the cooling performance is insufficient for high-density computing devices
Solution Approach 1:
The patent transitions from air-cooled to liquid-cooled systems, using liquid coolant circulated through cooling channels to achieve superior heat transfer performance. The liquid cooling system includes pumps, heat exchangers, and coolant circulation loops that effectively remove heat from high-density electronic devices, resolving the contradiction between simplicity and cooling performance.
2Temperature
If liquid-cooled systems are used to improve cooling performance, then cooling efficiency increases, but system complexity and cost increase
Solution Approach 1:
The patent divides the cooling system into multiple independent cooling channels, each targeting specific high-heat-generation components. The cooling system is segmented into separate loops for different device types (e.g., CPUs, GPUs, storage devices), allowing optimized cooling for each component while maintaining overall system manageability and reducing complexity.
Solution Approach 2:
The liquid cooling system is designed to serve multiple functions: cooling high-density computing devices, maintaining optimal operating temperatures, and providing thermal management for various component types. The same cooling infrastructure supports different device configurations and heat loads, reducing the need for separate cooling systems and lowering overall complexity.
3Temperature
If customised liquid cooling systems are implemented to achieve better cooling, then cooling performance improves, but installation complexity and cost increase
Solution Approach 1:
The patent employs standardized cooling parameters and modular cooling unit designs that can be configured for different device densities and thermal requirements. By establishing standard coolant flow rates, temperatures, and pressure parameters, the system achieves high cooling performance while maintaining ease of installation and manufacturing across different deployment scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides efficient, cost-effective, and reliable cooling by targeting high-temperature components with cold plates and immersive cooling, while maintaining overall module cooling performance and reducing complexity and potential leakage points.
Implementation Method 1
The first liquid coolant (or first coolant liquid) is cooled by transfer of heat to the second liquid coolant at a heat exchanger
Implementation Method 2
Each circulatory arrangement receives heat transferred from one or more respective electronic devices housed within the electronic module
Data Source
AI summary
A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.