Active Liquid Cooling Manifolds for Electronic Hotspot Control
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Solution Overview
Problem
Existing liquid cooling systems for electronic devices, particularly in high-density arrays, struggle to efficiently manage transitory hotspots due to fixed flow patterns, leading to inefficient energy use and potential overheating.
Innovation Solution
Implementing active manifolds controlled by a controller to dynamically adjust the flow of cooling liquid, redirecting it to hotspots as needed, using variable speed pumps, valves, or baffles to maintain optimal temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fixed flow pattern manifolds are used, then system simplicity is maintained, but transitory hotspots cannot be efficiently cooled
Solution Approach 1:
The patent applies dynamics by transforming static manifolds into dynamic systems with adjustable flow control devices. The manifolds now actively redirect cooling liquid flow in response to changing thermal conditions, enabling real-time adaptation to transitory hotspots while maintaining systematic control architecture.
Solution Approach 2:
The patent implements feedback mechanisms where temperature sensors detect hotspot conditions and signal the controller to adjust manifold flow control devices. This closed-loop feedback system enables the cooling system to respond to actual thermal conditions, efficiently directing cooling capacity to where it is most needed.
2Temperature
If cooling liquid flow is increased to cover hotspots, then hotspot cooling is improved, but energy efficiency decreases due to over-cooling
Solution Approach 1:
The patent applies local quality by enabling different regions of the cooling system to have different flow rates tailored to local thermal demands. Hotspot regions receive increased cooling liquid flow while non-hotspot regions receive reduced flow, optimizing overall system energy efficiency rather than uniformly increasing flow everywhere.
Solution Approach 2:
The dynamic flow control allows the system to adapt cooling distribution in real-time, increasing flow to hotspots only when and where needed. This dynamic adjustment prevents continuous over-cooling of non-hotspot regions, thereby improving energy efficiency while maintaining effective hotspot cooling.
3Adaptability or versatility
If manual manifold configuration is used, then adaptability to hotspots is limited, but system complexity is reduced
Solution Approach 1:
The patent employs feedback control where temperature sensors continuously monitor thermal conditions and automatically signal the controller to adjust manifold configurations. This automated feedback loop provides high adaptability to transitory hotspots without requiring complex manual reconfiguration procedures.
Solution Approach 2:
The cooling system performs self-service by automatically detecting and responding to hotspot conditions without manual intervention. The controller and flow control devices work autonomously to redirect cooling liquid flow based on real-time thermal feedback, enhancing adaptability while keeping operational complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides adequate cooling to transitory hotspots while reducing overall cooling capacity and maintaining efficient operation of the heat dissipation apparatus, enhancing IC longevity and operational stability.
Implementation Method 1
causing the cooling liquid to absorb heat from the devices 100
Implementation Method 2
circulate the cooling liquid through pipes 118... in thermal communication with the electronic devices 100
Implementation Method 3
external heat dissipation apparatus 108, 110
Implementation Method 4
heat exchanger 108 and cooling tower 110
Implementation Method 5
heat exchanger 108 and cooling tower 110
Data Source
AI summary
A system configured for cooling electronic devices comprises a pair of opposing, active manifolds that control a flow of cooling liquid through pipes or through an immersion tank past the electronic devices. A controller detects and/or predicts localized hotspots and adjusts flow control devices associated with inlets and outlets of the manifolds to direct proportionately more cooling liquid to the hotspots. The flow control devices can be any combination of variable speed pumps and/or adjustable valves, vents, and/or baffles. Manifolds can be placed on two opposing sides of the devices, on four opposing sides, and/or above and/or below the devices. Temperatures proximate the devices can be measured by separate sensors and/or sensors integral to components of the electronic devices. Hotspots can be predicted by monitoring current flows, power flows, and/or voltages of the electronic devices, and/or inferred from network activity and/or from a workload queue.