Display Thermal Pad Layout for Compact IC Heat Dissipation
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Solution Overview
Problem
Display devices in outdoor spaces, particularly in elevators, generate excessive heat due to prolonged operation, leading to failures and malfunctions, and existing heat management systems are inefficient and not tailored to individual operating states.
Innovation Solution
A display device with thermal pads and aluminum plates configured to dissipate heat efficiently, using temperature sensors to control operations and calculate optimal heat dissipation based on the device's operating state, with insulating bands to prevent heat retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are used to manage heat, then heat dissipation is improved, but device size and bulkiness increase
Solution Approach 1:
The patent replaces bulky heat sinks with thin-film thermal pads that have high thermal conductivity. The thermal pad is a thin flexible component that can be directly attached to the IC chip, providing effective heat dissipation without increasing device volume. This resolves the contradiction by achieving good heat dissipation (improving_feature) while maintaining a compact form factor (worsening_feature).
Solution Approach 2:
The patent extracts the heat dissipation function from the traditional heat sink structure and integrates it directly into the IC chip assembly through thermal pads. By taking out the bulky heat sink component and replacing it with a thin thermal pad layer, the solution achieves efficient heat management while eliminating the bulkiness problem.
2Ease of manufacture
If universal heat management standards are applied, then implementation simplicity is improved, but heat management optimization for specific operating states deteriorates
Solution Approach 1:
The patent implements dynamic heat management by adjusting the thermal pad configuration based on the actual operating state of the display device. The system can modify heat dissipation strategies according to real-time conditions such as usage patterns and environmental factors, transforming static universal standards into dynamic optimized solutions that adapt to specific operating scenarios.
Solution Approach 2:
The patent changes thermal management parameters based on operating states. By monitoring device temperature and usage patterns, the system adjusts thermal pad properties or configuration parameters to optimize heat dissipation for specific operating conditions, thereby achieving both simplicity in implementation and optimization for individual scenarios.
3Temperature
If thermal pads are attached to IC chips, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal pad with the IC chip assembly structure, integrating heat dissipation functionality into the existing component layout. By combining the thermal pad attachment directly with the IC chip mounting process, the solution achieves efficient heat dissipation without significantly increasing overall device structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat dissipation by preventing overheating and maintaining optimal operating temperatures, reducing the risk of failures and ensuring continuous functionality while conserving energy.
Implementation Method 1
a high conductivity silicon thermal pad on a group of IC chips of a main board, and to attach an aluminum plate to the thermal pad, so that heat generated by the IC chips can be dissipated with high efficiency
Implementation Method 2
by configuring the aluminum plate to interview the metal housing at the rear of the housing, it has the effect of allowing heat to be easily dissipated to the outside through the metal housing
Implementation Method 3
heat can be easily dissipated through the metal housing to the outside
Implementation Method 4
the sides of the thermal pad and aluminum plate are configured to have insulating bands wrapped around them, so that the heat transferred to the thermal pad and aluminum plate can be dissipated through the metal housing to the outside, rather than being retained inside the housing
Data Source
AI summary
A display device includes: a main board having at least one IC chip on a first side and at least one IC chip on a second side; a first thermal pad attached to the at least one IC chip provided on the first side of the main board; a second thermal pad attached to the at least one IC chip on the second side of the main board; a first aluminum plate provided on the first thermal pad; a second aluminum plate provided on the second thermal pad, wherein the first aluminum plate is configured to be in contact with a specific area of a predetermined area of the rear housing of the enclosure, wherein the second aluminum plate is configured to be in contact with a touchscreen panel.