Redundant Liquid Cooling Manifolds for Aircraft Power Modules
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Solution Overview
Problem
Semiconductor power modules in power converters, particularly in critical applications like aircraft, require high-performance liquid cooling systems with operational redundancy to meet failure rate requirements and ensure continuous operation.
Innovation Solution
A dual-flow circuit cooling system is implemented, where two flow circuits are arranged in parallel and series configurations across multiple power converter modules, each with integrated microchannel structures and manifolds, eliminating the need for separate cooling lines and pumps, and incorporating redundant fluid drivers for continued operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a redundant cooling system is implemented for power converter modules, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated liquid cooling system that serves multiple power converter modules simultaneously. The system uses shared coolant flow paths and common cooling infrastructure to provide redundant cooling capability across multiple modules without requiring separate cooling systems for each module, thereby reducing overall system complexity while maintaining reliability
Solution Approach 2:
The liquid cooling system is designed with universal applicability to cool multiple different power converter modules using the same cooling infrastructure. The system can adapt to serve various modules through its modular manifold design, allowing a single cooling system to perform multiple cooling functions across different modules, reducing the need for module-specific cooling components
2Reliability
If separate cooling lines and pumps are used for each power converter module, then reliability is improved, but weight increases
Solution Approach 1:
The patent merges multiple separate cooling lines into shared coolant flow paths that serve multiple power converter modules. By consolidating the cooling infrastructure, the system eliminates redundant piping and reduces the total amount of cooling components required, thereby reducing weight while maintaining cooling capability across all modules
Solution Approach 2:
The cooling system uses universal coolant flow paths that can serve multiple power converter modules simultaneously. The shared cooling infrastructure performs multiple cooling functions across different modules, eliminating the need for duplicate cooling lines and pumps for each module, thus reducing overall system weight
3Temperature
If a dual-flow circuit cooling system is implemented, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The patent segments the cooling system into two independent flow circuits (first and second flow circuits) that can operate separately or simultaneously. Each flow circuit has its own coolant flow path and can be controlled independently, allowing the system to provide enhanced cooling performance while maintaining manageable complexity through modular circuit design
Solution Approach 2:
The patent combines multiple flow circuits into a single integrated liquid cooling system that serves multiple power converter modules. By merging the circuits at the system level rather than keeping them completely separate, the patent achieves improved cooling performance through multiple flow paths while reducing overall complexity through shared infrastructure and common cooling components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enhances cooling performance, reduces system complexity, and achieves weight savings while ensuring continuous operation of power converters at or above half their rated power without deactivation, meeting stringent reliability standards.
Implementation Method 1
The microchannel structure is coupled to the heat transfer surface
Implementation Method 2
liquid cooling systems to extract the heat generated in power semiconductor packages
Implementation Method 3
The first flow circuit is fluidly coupled in series flow arrangement to the first flow manifold of each of the plurality of power converter modules. The second flow circuit is fluidly coupled to the second flow manifold of each of the plurality of power converter modules
Data Source
AI summary
A power converter system for use in an aircraft includes a plurality of power converter module assemblies and a cooling system. Each power converter module assembly of the plurality of power converter module assemblies includes a semiconductor package, a first flow manifold, and a second flow manifold. The semiconductor package defines a heat transfer surface. The first flow manifold and the second flow manifold are thermally coupled to the heat transfer surface. The cooling system includes a first flow circuit and a second flow circuit. The first flow circuit is fluidly coupled in series flow arrangement to the first flow manifold of each of the plurality of power converter module assemblies. The second flow circuit is fluidly coupled to the second flow manifold of each of the plurality of power converter module assemblies.