Phase-Change Backup Cooling for Electronic Heat Loads
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Solution Overview
Problem
Conventional cooling systems for electronic components are vulnerable to overheating and equipment damage when external cooling systems fail, leading to potential system failures.
Innovation Solution
An uninterruptible cooling system with a heat exchanger and a heat transfer compound in a UCS that transitions between solid and liquid phases to absorb and reject heat, maintaining temperature within a safe range for the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an external cooling system is used to remove heat from electronic components, then cooling efficiency is improved, but system reliability deteriorates due to vulnerability to cooling system failures
Solution Approach 1:
The patent changes the physical state parameter of the heat transfer compound (solid to liquid phase transition) to enable passive heat absorption. The compound is selected with a phase change threshold temperature that is greater than the operating temperature of the heat exchange fluid and less than the maximum temperature of the electronic component, allowing it to automatically activate when the external cooling system fails.
Solution Approach 2:
The patent utilizes the phase transition phenomenon of the heat transfer compound, which transitions from solid to liquid state at a specific threshold temperature. This phase change absorbs latent heat from the electronic component, providing passive cooling protection without requiring external power or active control systems.
2Reliability
If a heat transfer compound with phase change capability is introduced, then backup cooling protection is improved, but device complexity increases
Solution Approach 1:
The heat transfer compound operates autonomously based on temperature conditions, automatically absorbing heat when the phase change threshold is reached. The system requires no external control, power supply, or active management, as the phase transition occurs naturally in response to temperature changes, making the backup cooling system self-regulating and simple.
Solution Approach 2:
The heat transfer compound acts as an intermediary substance between the electronic component and the external cooling system. It mediates heat transfer by absorbing excess heat through phase change when the external cooling system is operational, and by providing passive cooling protection when the external system fails.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures continuous cooling of electronic components by absorbing excess heat during external cooling system failures, preventing overheating and equipment damage, and providing a temporary cooling solution until repairs can be made.
Implementation Method 1
The heat transfer compound within the Uninterruptible Cooling Supply has a solid to liquid phase change threshold that is greater than the operating temperature of the heat exchange fluid downstream of the heat exchanger and less than the maximum temperature of the heat generating electronic component
Implementation Method 2
The heat transfer compound absorbs heat from the heat exchange fluid when the operating temperature of the heat exchange fluid is above the phase change threshold
Implementation Method 3
The heat transferred by the heat generating electronic component to the heat exchange fluid is absorbed by the heat exchanger
Implementation Method 4
a fluid pump to circulate the heat exchange fluid through conduits fluidly connecting the first container, the second container, and the UCS
Data Source
AI summary
An uninterruptible cooling system includes a heat generating electronic component enshrouded by a first container, a heat exchanger enshrouded by a second container, and an Uninterruptible Cooling Supply (UCS). The uninterruptible cooling system further includes a heat exchange fluid and a fluid pump to circulate the heat exchange fluid through conduits fluidly connecting the first container, the second container, and the UCS. The UCS includes a radiator enshrouded by a casing and a heat transfer compound positioned in a space external to the radiator and internal to the casing. The heat transfer compound within the Uninterruptible Cooling Supply has a solid to liquid phase change threshold that is greater than the operating temperature of the heat exchange fluid downstream of the heat exchanger and less than the maximum temperature of the heat generating electronic component.