Microfinned Water Cooling Block for Uniform Hashboard Chip Cooling
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Solution Overview
Problem
Conventional water cooling blocks for cryptocurrency mining devices, such as Bitcoin miners, suffer from uneven cooling, leading to high chip temperatures, reduced efficiency, and increased maintenance costs due to hotspots and non-uniform temperature distribution.
Innovation Solution
A water cooling block design featuring a baseplate with raised surfaces and microfins, a cover with central and peripheral water ports, and a water channel configuration that optimizes cooling water distribution, ensuring uniform heat transfer across the mining device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional channel-type water cooling blocks are used, then water cooling is more efficient than air cooling, but uneven cooling and hotspots occur leading to high chip temperatures
Solution Approach 1:
The patent applies local quality by incorporating microfins specifically on the inner surface of the baseplate where heat generation is highest. This localized enhancement creates superior heat transfer areas precisely where needed, addressing the hotspot issue without requiring complete redesign of the entire cooling block.
Solution Approach 2:
The patent transitions from conventional two-dimensional channel cooling to three-dimensional cooling by adding microfins that extend vertically from the baseplate inner surface. This dimensional addition dramatically increases the heat transfer surface area and creates multiple flow paths for cooling water, eliminating hotspots through enhanced thermal distribution.
2Ease of manufacture
If basic channel design is used, then manufacturing is simple, but cooling effectiveness decreases due to non-uniform temperature distribution
Solution Approach 1:
The patent segments the cooling function into multiple components: the baseplate with integrated channels and the separate microfins attached to the inner surface. This segmentation allows each component to be manufactured independently using standard processes, while the combined system achieves superior cooling through the synergistic interaction of the segmented elements.
Solution Approach 2:
The patent changes the physical parameters of the cooling system by introducing microfins with specific dimensions (height, width, spacing) that optimize heat transfer coefficients. These parameter modifications enhance cooling efficiency while remaining compatible with conventional manufacturing techniques, balancing manufacturing simplicity with improved performance.
3Loss of energy
If water cooling is implemented, then heat dissipation improves, but device complexity increases compared to air cooling
Solution Approach 1:
The patent merges the cooling channels and microfins into a single integrated baseplate assembly that attaches directly to the mining device. This consolidation combines multiple cooling functions into one unified component, reducing the number of separate parts and simplifying installation while maintaining effective heat dissipation.
Solution Approach 2:
The cooling system is designed to be self-regulating through natural convection patterns and the inherent thermal conductivity of the baseplate material. The microfins passively enhance heat transfer without requiring active control mechanisms, reducing system complexity while maintaining effective cooling throughout the operating range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved cooling block achieves more uniform chip temperatures, extending device lifespan, reducing maintenance costs, and enabling energy savings through efficient cooling, suitable for various climates and hybrid cooling methods.
Implementation Method 1
As the warm components come into contact with the water cooling block, the heat is transferred to the circulating water
Implementation Method 2
microfins arranged on a majority of the inner surface
Implementation Method 3
The heated water is then transferred to a cooling unit, often located outside the mining facility, where it releases the heat into other mediums for further use or into the environment
Data Source
AI summary
A water cooling block comprises a baseplate having an inner surface and an outer surface having a plurality of raised surfaces adapted to contact integrated circuits mounted on a hashboard, microfins arranged on the inner surface, a cover mounted to the baseplate and forming a cooling water distribution chamber therebetween. A first water port is arranged at a central location on one side plate of the cover, second and third water ports are arranged at opposite ends of the one side plate of the cover, and a water channel is arranged between other side plates of the cover and a perimeter of the cooling water distribution chamber. The water channel receives heated water from or supplies cooling water to the cooling water distribution chamber at a location distal from the first water port, and the water channel extends to each of the second and third water ports.