Power Electronics Cooler with Parallel Coolant Paths
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Solution Overview
Problem
Existing power electronics systems face challenges in managing heat generation efficiently while operating within space constraints, often requiring compact thermal control solutions.
Innovation Solution
A cooler design featuring parallel coolant paths, overlapping mounting surfaces, and pin fin plates that facilitate efficient heat rejection and uniform temperature distribution across power electronics modules, utilizing various manufacturing techniques and materials for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If compact thermal control solutions are used to address space constraints, then space efficiency is improved, but thermal management efficiency may deteriorate
Solution Approach 1:
The patent implements nested cooling channels where coolant paths are positioned between overlapping mounting surfaces of power electronics modules. This nesting approach allows thermal management within the compact stacked architecture, improving heat rejection efficiency without increasing external dimensions.
Solution Approach 2:
The patent transitions from planar cooling to three-dimensional thermal management by utilizing vertical stacking of mounting surfaces and implementing coolant paths that flow through multiple levels. This dimensional approach enables efficient thermal control in compact spaces by exploiting the third dimension for heat dissipation.
2Area of stationary object
If multiple power electronics modules are stacked to reduce space, then space efficiency is improved, but heat generation and thermal management complexity increase
Solution Approach 1:
The cooler design serves multiple functions simultaneously: it provides mounting surfaces for multiple power electronics modules, incorporates coolant paths for thermal management, and includes pin fin plates for enhanced heat dissipation. This multi-functionality reduces overall system complexity despite the stacked configuration.
Solution Approach 2:
The patent divides the cooling system into segmented coolant paths that serve different mounting surfaces independently. Each coolant path can be optimized for its specific module, simplifying thermal management of each component while maintaining compact overall structure.
3Temperature
If conventional cooling methods are used, then thermal management is achieved, but thermal resistance and temperature non-uniformity increase
Solution Approach 1:
The patent implements pin fin plates at specific locations on the mounting surfaces to enhance heat dissipation where needed. This local enhancement of heat transfer capability reduces thermal resistance and improves temperature uniformity across the power electronics modules without requiring complete redesign of the entire cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooler achieves improved thermal efficiency, reduced thermal resistance, and uniform temperature distribution among modules, enhancing overall performance and reducing the need for thermal grease.
Implementation Method 1
coolant paths extending between an inlet and an outlet, the coolant paths providing parallel flows among the first and second mounting surfaces
Implementation Method 2
first pin fin plates for the first mounting surfaces, respectively, and second pin fin plates for the second mounting surfaces, respectively
Data Source
AI summary
Coolers for power electronics have mounting surfaces for power electronics modules and provide coolant flow using coolant paths. Base plates for power electronics can include pin fins. An inlet manifold can extend in a space between base plates. Parallel flows of coolant can abut respective halves of mounting surfaces so that a fluid volume includes multiple subplate portions. Coolers can be manufactured by casting, molding, or lamination.