3D Module Heat Sink Structure for Low-Resistance Sensor Cooling
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Solution Overview
Problem
Existing solutions for cooling optoelectronic sensors in 3D electronics modules are costly, complex, and compromise the compactness of the module, with limited heat exchange area and high thermal resistance between the sensor and the cradle.
Innovation Solution
A heat sink component made of thermally conductive material that thermally connects the optoelectronic sensor to a rigid cradle, increasing the heat exchange area and reducing thermal resistance by creating a thermal circuit to external cooling means, while maintaining module compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a Peltier heat exchanger and heatsink are added to cool the sensor, then the sensor temperature is reduced and thermal noise decreases, but the module complexity and cost increase significantly
Solution Approach 1:
The patent merges the heat sink function directly into the cradle structure by adding a thermally conductive element that contacts both the sensor and the cradle's external cooling interface. This integration eliminates the need for separate Peltier heat exchangers and standalone heatsinks, reducing component count and assembly complexity while maintaining effective sensor cooling
Solution Approach 2:
The cradle is designed to serve multiple functions: it provides mechanical support for the sensor, acts as a thermal conduction path to external cooling means, and serves as a structural frame for the module. The thermally conductive element integrated into the cradle enables the cradle to simultaneously perform structural and thermal management functions
2Temperature
If a Peltier heat exchanger and heatsink are added to cool the sensor, then the sensor temperature is reduced, but the manufacturing cost increases
Solution Approach 1:
By integrating the heat sink function into the existing cradle structure rather than adding separate Peltier devices and heatsinks, the patent reduces the number of parts that need to be manufactured, procured, and assembled. This integration simplifies the bill of materials and reduces overall manufacturing cost while achieving the same thermal management objective
Solution Approach 2:
The cradle structure itself serves as the thermal conduction path to external cooling means, eliminating the need for additional active cooling components. The design uses the existing structural elements to perform thermal management functions, reducing dependency on expensive specialized cooling components
3Device complexity
If the cradle acts as a thermal mass with passive cooling, then the structure is simple, but the heat exchange area between the cradle and sensor is limited to the periphery only
Solution Approach 1:
The patent extends the thermal conduction path from the sensor to the cradle by adding a thermally conductive element that creates additional contact surfaces. This element bridges the sensor mounting surface to the cradle's external cooling interface, effectively increasing the heat exchange area from peripheral contact only to include the sensor's lower face and intermediate thermal paths
4Device complexity
If the cradle acts as a thermal mass with passive cooling, then the structure is simple, but the thermal resistance between the sensor and cradle is high
Solution Approach 1:
The thermal management path is segmented into distinct thermal conduction stages: sensor lower face to thermally conductive element, thermally conductive element to cradle, and cradle to external cooling means. This segmentation allows optimization of each interface with appropriate thermally conductive materials and contact surfaces, reducing overall thermal resistance while maintaining structural simplicity
Solution Approach 2:
A thermally conductive element is introduced as an intermediary between the sensor and the cradle. This intermediate component improves thermal coupling by providing enhanced contact surfaces and thermal conduction paths, reducing thermal resistance at the sensor-cradle interface without complicating the overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces thermal noise and dark current, improving image quality in low-brightness environments by keeping the sensor at a low temperature, while being cost-effective and compatible with various sensor types and module configurations.
Implementation Method 1
A heat sink component made of thermally conductive material that thermally connects the optoelectronic sensor to a rigid cradle, increasing the heat exchange area and reducing thermal resistance
Implementation Method 2
The performance of an optoelectronics sensor decreases drastically when the temperature increases. The dark current increases and so black becomes gray at the time of detection. This poses problems in space applications where black is predominant in most of the images.
Data Source
AI summary
A heat sink component is made of a thermally conductive material and intended to thermally connect an optoelectronics sensor to a rigid cradle cooled by external cooling means; the optoelectronics sensor being mounted on a printed circuit; the cradle having at least one fixing boss and an opening intended to house the optoelectronics sensor; the heat sink component including a base intended to be placed in thermal contact with at least one fixing boss of the cradle; a protuberance intended to be placed in thermal contact with a lower face of the optoelectronics sensor through a hole passing through the printed circuit.