Printed Circuit Assembling TRIZ Cases

Timed start-stop control keeps each reflow heating sub-zone within range, preventing overheating while handling large and small circuit boards.

An in-furnace black body calibration setup keeps infrared temperature sensing accurate across multiple heating zones without disassembly.

Adjustable rods and fixtures let a reflow oven support upper housing deformation while maintaining uniform stress, sealing, and service life.

Pressed Sn-based sheet solder aligns crystal c-axes perpendicular to thickness, reducing electromigration in high-current semiconductor joints.

A dual-cure PCB inkjet composition builds an interpenetrating polymer network to improve adhesion, ENIG plating resistance, and thermal stability.

Two solder powders with different melting ranges enable lower reflow while preserving joint strength, ductility, and stability in later heating.

Flux vapor purification protects the vacuum chamber and pump while vacuum reflow removes solder voids for more reliable circuit boards.

Electromagnetic induction coils around the jet nozzle preheat PCB through holes so molten solder reaches the upper hole and avoids early solidification.

A tension roller and sensor detect misaligned conveyor fingers before PCB or conveyor damage occurs in wave soldering.

IR cameras feed real-time PCB temperature data to adjust heating, conveyor speed, and blowers for more stable soldering and reliable joints.

Balanced Ag-Cu-Bi-Ni-Ge in Sn solder suppresses oxide-driven fusion failure and raises bonded-interface shear strength.

A neck-and-shoulder fastener lets stacked electronic components be attached or removed independently, reducing damage risk while aiding EMI shielding.

Downstream upper and lower gas cooling starts solder curing sooner in jet soldering, preventing embrittlement with low-temperature solder.

A tuned Sn-Ag-Cu-Ni-Ge composition refines interface grains to improve shear strength, suppress fusion failure, and control Ni leaching.

Selective vacuum control and sized pick-up holes let one tool pick single solder balls accurately, reducing repeats, damage, and tool changes.

Mixed molten solder from dual supply ports stays continuous during conveyance, limiting oxidation and waste while stabilizing Sn-58Bi jet soldering.

A mixed liquid-solid solvent flux suppresses crystallization during cold storage, maintaining solder paste viscosity and print consistency.

A reciprocating extension part changes height in molten solder to break down dross faster while a partition keeps oxides away from the supply unit.

Localized shielding and secondary heating balance small and large component temperatures to form reliable PCB solder joints.

Local shields and secondary heating balance large and small component temperatures to improve PCB solder joint quality without overheating.

A pivoting retainer and spring-loaded plunger clamp circuit elements through board apertures, enabling automated alignment and soldering.

Balanced dicarboxylic acids and thixotropic agents improve microland solder spreadability while protecting flexible board insulation coatings.

An angled cooling-zone base plate drains condensed flux into a collection area, keeping drips off circuit boards and extending maintenance intervals.

A conductive bridge links the optoelectronic sensor to the cooled cradle, expanding heat exchange area while preserving 3D module compactness.

A Sn-In-Ge solder composition keeps a 130-210°C melting range while suppressing oxide growth after high-temperature holding.

Rotatable support bars lift wide circuit boards during reflow transport to limit sagging, deformation, and yield loss.

A multi-element tin-based solder balances liquidus temperature, strength, and creep resistance for reliable high-temperature electronics.

Printed solder position data reveals screen mask deformation and misalignment, enabling accurate printability judgment and faster correction.

Breaking residue on solder-precoated lands and applying flux before reflow helps prevent oxidation, reduce soldering defects, and avoid cleaning.

A polymer-resin flux stays pliable and tack-free after drying, preventing cracking and preserving wetting for reliable solder joints.

A surrounding blower flow path redistributes gas across suction ports to stabilize soldering temperature and reduce pressure loss.

A laser-bonded patterned layer lets a ferrule flange be welded onto a dielectric substrate, reducing thermal stress and simplifying hermetic sealing.

A nested inner- and outer-tube condenser increases heat-transfer area to remove more water vapor without enlarging flux recovery equipment.

A bridge-supported FPC mounting portion resists reflow warping, keeping soldered circuit components accurately positioned.

A hood-coupled cover and hoist mechanism open the pressure chamber in one motion, speeding inspection, cleaning, and setup.

Filtering molten lead-free solder to 10 μm and adding a fatty acid surface layer improves fine PCB solder flow, appearance, and joint strength.

Push rivets replace screws and bonds to secure furnace gaskets faster, simplify replacement, and maintain uniform sealing pressure.

Dual solder jets are mixed and kept attached to the moving substrate to suppress oxide generation and improve solder attachment cleanliness.

Gas-path monitoring and periodic exhaust heating prevent flux condensation, maintain exhaust flow, and improve PCB soldering quality.

Perimeter test pads linked to a central PCB pad enable accurate reflow temperature profiling without drilling damage or contact uncertainty.

A Sn-Ag-Cu-Bi-Ni-Ge solder composition refines interface grains to raise shear strength, suppress fusion failure, and limit Ni leaching.

A stencil-guided solder paste reflow process restores uniform solder ball height after test board removal, improving remounting and fixture clamping.

A nested inner- and outer-tube condenser removes more water vapor from soldering gas streams without increasing size, helping prevent condensation defects.

Movable nozzle plates and baffles adjust solder wave width automatically to reduce dross and avoid manual exposure to molten solder.

Movable nozzle plates and a solder distribution baffle adjust wave width automatically to reduce dross and operator exposure.

Laser-melted solder is jetted into the pin-through-hole gap to raise fill degree, strengthen joints, and speed PCB soldering.

Balanced Ag-Cu-Bi-Ni-Ge additions help lead-free, antimony-free solder joints gain strength while limiting intermetallic growth.

A high-boiling solvent and polyamide thixotropic agent cut flux residue while suppressing heating sagging during solder bonding.

Resistance feedback controls joining heat when wiring flexible circuit pads, preventing polymer damage while maintaining connection quality.

A high-boiling solvent and polyamide thixotrope help rosin-free flux cut residue while suppressing heating sagging during solder bonding.