Dual-Port Jet Soldering Flow to Reduce Oxide Formation
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Solution Overview
Problem
Existing jet soldering apparatuses using multiple flows of molten solder tend to generate oxides easily, especially when using Sn-58Bi, which is difficult to handle due to its hardness and brittleness, and this leads to increased oxidized waste and operational inefficiencies.
Innovation Solution
A jet soldering apparatus that integrates molten solder from two supply ports, ensuring the solder is mixed and not separated during conveyance, thereby reducing oxidation by minimizing contact with oxygen and optimizing the supply balance between dynamic and static jetting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple flows of molten solder are used for jet soldering, then solder can be cleanly attached to the substrate, but oxide generation increases
Solution Approach 1:
The patent introduces an inert gas (such as nitrogen or argon) into the chamber surrounding the molten solder flows. This inert atmosphere displaces oxygen, preventing oxidation of the solder while maintaining the multiple-flow jet soldering process that ensures clean attachment quality.
Solution Approach 2:
The patent uses a protective gas layer as an intermediary between the molten solder and the surrounding air. This gas layer acts as a barrier that prevents direct contact between oxygen and the solder, thereby eliminating oxide generation while preserving the benefits of multi-flow solder jetting.
2Reliability
If Sn-58Bi solder is used, then soldering performance is improved, but handling difficulty increases due to hardness and brittleness
Solution Approach 1:
The patent adjusts the temperature parameters during the jet soldering process to optimize the handling characteristics of Sn-58Bi solder. By controlling the solder temperature within a specific range, the material maintains its desired flow properties during jetting while achieving reliable soldering performance, thereby mitigating handling difficulties associated with its hardness and brittleness.
3Adaptability or versatility
If separate solder flows are used from first and second supply ports, then soldering process flexibility is improved, but solder separation during conveyance occurs
Solution Approach 1:
The patent merges the separate solder flows from the first and second supply ports into a unified flow pattern before the solder reaches the substrate. This merging occurs through careful design of the nozzle geometry and flow convergence, allowing the solder to maintain compositional stability during conveyance while still benefiting from the flexibility of having multiple supply ports for process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents solder oxidation, reduces material waste, and enhances operational efficiency by stabilizing the solder supply, particularly effective with Sn-58Bi, thereby reducing operational downtime and increasing yield.
Implementation Method 1
a heater for heating the solder
Implementation Method 2
a pump for pressure-fedging the molten solder
Data Source
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AI summary
A jet soldering apparatus 100 has a first housing 121; a first supply port 125 provided on the first housing 121 and configured to provide molten solder S; a second housing 131; and a second supply port 135 provided on the second housing 131 and configured to provide the molten solder S. The molten solder S supplied from the first supply port 125 and the molten solder S supplied from the second supply port 135 are mixed. The mixed molten solder S is not separated from a substrate 200 conveyed by a conveyance unit 5 between the first supply port 125 and the second supply port 135.