Wave Soldering Nozzle Assembly for Adjustable Solder Wave Width
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Solution Overview
Problem
Existing wave soldering machines face challenges in controlling solder flow, which is difficult to adjust and poses risks to operators, and result in the formation of dross, a solid impurity on the surface of molten solder.
Innovation Solution
A wave soldering machine with a nozzle assembly that includes a solder distribution baffle and movable or rotatable nozzle plates, actuated by controllers, to adjust the width of the solder wave, combined with centrifugal pumps to control the flow of molten solder, minimizing dross formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of solder flow is used in traditional wave soldering machines, then operators can control the solder wave, but operator safety is compromised due to exposure to molten solder and adjustment becomes difficult
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated control system that uses sensors to detect solder wave characteristics and actuators to adjust the nozzle position or solder flow rate, eliminating operator exposure to molten solder while maintaining control capability
Solution Approach 2:
The patent introduces an intermediary control system between the operator and the solder flow, using sensors and controllers to mediate the adjustment process, allowing operators to control solder flow remotely without direct contact with hazardous molten solder
2Manufacturing precision
If wide solder wave is produced to ensure complete coverage, then soldering quality improves, but dross formation increases
Solution Approach 1:
The patent makes the solder wave width dynamic and adjustable based on real-time detection of PCB layout and component distribution, allowing the system to produce wide waves when needed for coverage and narrow waves when sufficient for reducing dross, rather than maintaining a fixed wide wave configuration
Solution Approach 2:
The patent changes the solder wave parameters (width, height, flow rate) dynamically based on detected requirements, adjusting these parameters to optimize the balance between achieving complete soldering coverage and minimizing dross formation through precise control
3Object-affected harmful factors
If automated control system is implemented to improve safety, then operator safety improves, but device complexity increases
Solution Approach 1:
The patent implements a self-regulating control system that automatically detects solder wave characteristics and adjusts parameters without complex external intervention, using feedback from sensors to autonomously maintain optimal settings and reduce system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for automated control of solder wave width, reducing dross formation and eliminating the need for human intervention, thereby enhancing safety and efficiency in soldering operations.
Implementation Method 1
The pump impellers are positioned within the reservoir of the solder pot adjacent the flow duct
Data Source
AI summary
A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.