Vacuum Ball Attach Tool for Single Solder Ball Pickup
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Solution Overview
Problem
Existing ball attach tools face inefficiencies in picking up solder balls, including repeated operations leading to increased time and potential damage, and require multiple tools for different sizes, causing process delays.
Innovation Solution
A ball attach tool with a housing and valve module that includes pick-up holes and a valve mechanism to control reduced pressure, allowing selective control of vacuum application to accurately pick up one solder ball and accommodate different sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple solder balls are picked up in one pick-up hole, then the pick-up operation must be repeated, but this increases the time for the ball attach process and may damage the solder ball
Solution Approach 1:
The pick-up holes are segmented into different sizes (first pick-up holes for first-size solder balls, second pick-up holes for second-size solder balls) and are selectively activated through separate branch lines. This segmentation allows each hole to pick up exactly one appropriately-sized solder ball in a single operation, eliminating the need for repeated pick-up operations and reducing process time.
2Quantity of substance
If multiple solder balls are picked up in one pick-up hole, then the pick-up operation must be repeated, but this increases the time for the ball attach process and may damage the solder ball
Solution Approach 1:
The pick-up holes are segmented into different sizes (first pick-up holes for first-size solder balls, second pick-up holes for second-size solder balls) and are selectively activated through separate branch lines. This segmentation ensures that each solder ball is picked up once by the appropriately sized hole, preventing repeated operations that could damage the solder ball.
3Adaptability or versatility
If ball attach tools with pick-up holes corresponding to different solder ball sizes are used, then different sizes can be accommodated, but tool exchange is required causing delay
Solution Approach 1:
The housing integrates multiple pick-up holes of different sizes (first pick-up holes and second pick-up holes) and multiple branch lines into a single tool. The valve module enables selective activation of different branch lines, allowing the single tool to adapt to different solder ball sizes without requiring tool exchange, thus eliminating time loss while maintaining versatility.
4Measurement precision
If selective control of reduced pressure is implemented, then accurate picking of single solder ball is achieved, but valve module complexity is added
Solution Approach 1:
The pressure control system is segmented into multiple branch lines (first branch line, second branch line) that can be independently controlled. Each branch line connects to specific pick-up holes of corresponding sizes. The valve module controls pressure supply to each branch line separately, enabling precise selection and pickup of single solder balls of specific sizes while maintaining manageable system complexity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool reduces the need for repeated pick-up operations, minimizes ball damage, and streamlines the process by ensuring accurate picking of solder balls of varying sizes without requiring tool exchanges.
Implementation Method 1
The pick-up holes may be connected to the branch lines and configured to pick up balls when the reduced pressure is applied
Data Source
AI summary
A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes.