Wave Solder Nozzle Control for Adjustable Solder Flow Width
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Solution Overview
Problem
Existing wave soldering machines face challenges in controlling solder flow, which is difficult to adjust and poses risks to operators, and result in the formation of dross, a mass of solid impurities in molten solder.
Innovation Solution
A wave soldering machine with a nozzle assembly that includes a solder distribution baffle and movable or rotatable nozzle plates, actuated by controllers, to adjust the width of the solder wave, combined with pump impellers to control the flow of molten solder, minimizing dross formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of solder flow is used in traditional wave soldering machines, then operators can control the solder wave, but operator safety is compromised due to exposure to molten solder and adjustment becomes difficult
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated control system that uses sensors to detect solder wave characteristics and actuators to adjust the nozzle position or baffle configuration, eliminating operator exposure to molten solder while maintaining control capability
Solution Approach 2:
The system enables self-adjustment through automated feedback control where sensors monitor the solder wave and the control system automatically modifies the solder flow parameters without human intervention, making the system self-regulating and safe
2Productivity
If traditional wave solder nozzles are used, then solder flow can occur, but dross formation increases due to uncontrolled solder flow
Solution Approach 1:
The patent implements dynamic control of the solder wave width through movable baffles or adjustable nozzles that can change configuration during operation, allowing the system to optimize solder flow patterns to minimize dross while maintaining productivity
Solution Approach 2:
The system changes physical parameters such as solder wave width, flow velocity, and temperature distribution through automated adjustment of nozzle parameters and baffle positions, optimizing the soldering process to reduce dross formation
3Reliability
If automated control systems are implemented, then operator safety improves and dross formation reduces, but device complexity increases
Solution Approach 1:
The patent divides the nozzle assembly into modular components including separate sensors, actuators, baffles, and heating elements that can be independently controlled and maintained, managing complexity through functional segmentation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for automated control of solder wave width, reducing dross formation and eliminating the need for human intervention, ensuring safer and more efficient soldering operations.
Implementation Method 1
Each pump impeller may include a centrifugal pump to pump the molten solder to the wave soldering nozzle assembly
Implementation Method 2
The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave
Data Source
AI summary
A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.