Jet Solder Flow Mixing for Cleaner Substrate Attachment
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Solution Overview
Problem
Existing jet soldering apparatuses using multiple flows of molten solder tend to generate oxides easily, which affects the cleanliness of solder attachment to substrates.
Innovation Solution
A jet soldering apparatus that mixes molten solder from two supply ports, ensuring the mixed solder remains attached to the substrate without separation, by adjusting the width and distance of the supply ports and using dual drive units to control the solder flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple flows of molten solder are used for jet soldering, then solder attachment cleanliness is improved, but oxide generation increases
Solution Approach 1:
The patent merges multiple flows of molten solder into a single mixed flow before applying to the substrate. The first and second supply ports both discharge molten solder that mixes in mid-air or upon contact with the substrate surface, creating a unified solder application that reduces oxidation while maintaining attachment quality.
Solution Approach 2:
The patent ensures continuous supply of molten solder from both supply ports simultaneously, with the mixed solder continuously applied to the substrate without interruption. This continuous action prevents exposure to air that would cause oxidation, while maintaining the beneficial effects of multi-flow soldering.
2Stability of the object's composition
If the distance between first and second supply ports is reduced, then solder mixing efficiency is improved, but separation risk increases
Solution Approach 1:
The patent optimizes the distance parameter between the first and second supply ports to a specific range that enables effective mixing while preventing separation. By controlling this spatial parameter, the system achieves optimal solder flow interaction without excessive separation risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances solder attachment cleanliness and suppresses oxide generation, reducing material waste and operational interruptions.
Implementation Method 1
jet soldering apparatus that supplies molten solder to a substrate
Data Source
AI summary
A jet soldering apparatus includes a first housing; a first supply port provided on the first housing and configured to provide first molten solder; a second housing; and a second supply port provided on the second housing and configured to provide second molten solder. The jet soldering apparatus is configured to mix the first molten solder and the second molten solder so as to obtain mixed molten solder. The jet soldering apparatus is configured to provide the mixed molten solder such that the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.