Screen Mask Inspection Using Solder Position Feedback
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Solution Overview
Problem
Existing screen masks used in solder paste printing processes are prone to deformation and positional misalignment due to tensile and pressing forces, leading to inaccurate printing and reduced yield, even when correction mechanisms are employed.
Innovation Solution
A screen mask inspection device that detects position information of printed solder paste using a solder position information detection unit, allowing for accurate good/bad quality judgment of the screen mask by considering external factors, and provides real-time feedback for corrective actions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a screen mask is held under tensile force to prevent slack, then the mask maintains structural stability, but deformation and positional misalignment occur during the printing process
Solution Approach 1:
The system performs preliminary measurement of screen mask positions before the printing process, detects potential deformations in advance, and calculates correction values proactively. This allows the system to prepare compensation strategies before actual printing occurs, preventing misalignment issues rather than reacting to them afterward.
Solution Approach 2:
The system implements a feedback mechanism where actual printing results are measured and compared against target positions. Correction values are calculated based on detected deviations, and these corrections are applied to subsequent printing operations. This closed-loop feedback system continuously improves printing accuracy despite mask deformation.
2Manufacturing precision
If correction mechanisms are employed to regulate relative position, then printing misalignment is reduced, but deformation exceeds allowable range making correction ineffective
Solution Approach 1:
The system measures and detects screen mask positions and deformations before the printing process begins. By identifying deformation patterns in advance, the system can calculate appropriate correction values and adjust printing parameters proactively, ensuring corrections remain effective even when deformations are significant.
Solution Approach 2:
The system dynamically changes printing parameters such as relative positioning offsets, squeegee pressure, and printing speed based on detected screen mask deformation. By adapting parameters to match actual mask conditions, the system maintains correction effectiveness across varying deformation levels.
3Manufacturing precision
If high-accuracy inspection is performed to detect mask deformation, then printing quality is improved, but inspection complexity and time increase
Solution Approach 1:
The system replaces complex mechanical measurement devices with optical detection methods using cameras and image processing. This substitution achieves high-accuracy inspection of screen mask positions and solder paste alignment while reducing mechanical complexity and inspection time.
Solution Approach 2:
The system creates digital images and models of the screen mask and printed patterns, then performs measurements and analysis on these copies rather than requiring direct physical measurement. This approach simplifies the inspection process while maintaining high accuracy through digital image processing techniques.
4Measurement precision
If detailed position information is collected for quality judgment, then inspection accuracy is improved, but data processing time increases
Solution Approach 1:
The system extracts only the critical position information needed for quality judgment, such as key landmark positions and relative distances, rather than processing all available data. This selective extraction maintains inspection accuracy while significantly reducing data processing time and computational load.
Solution Approach 2:
The system performs measurements at strategically selected locations and times, collecting sufficient but not excessive position information. By measuring only the most critical parameters and using interpolation for less critical areas, the system achieves adequate inspection accuracy with reduced processing requirements.
Data Source
AI summary
A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.